发明授权
- 专利标题： High pressure processing method and apparatus
- 专利标题（中）： 高压加工方法及装置
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申请号： US10688889申请日： 2003-10-21
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公开(公告)号： US07513265B2公开(公告)日： 2009-04-07
- 发明人: Tetsuya Yoshikawa , Yoichi Inoue , Katsumi Watanabe , Kaoru Masuda , Katsuyuki Iijima , Tomomi Iwata , Yusuke Muraoka , Kimitsugu Saito , Ikuo Mizobata
- 申请人： Tetsuya Yoshikawa , Yoichi Inoue , Katsumi Watanabe , Kaoru Masuda , Katsuyuki Iijima , Tomomi Iwata , Yusuke Muraoka , Kimitsugu Saito , Ikuo Mizobata
- 申请人地址： JP Kobe-shi JP Kyoto-shi
- 专利权人： Kabushiki Kaisha Kobe Seiko Sho,Dainippon Screen Mfg. Co., Ltd.
- 当前专利权人： Kabushiki Kaisha Kobe Seiko Sho,Dainippon Screen Mfg. Co., Ltd.
- 当前专利权人地址： JP Kobe-shi JP Kyoto-shi
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权： JP2002-307349 20021022
- 主分类号： B08B6/00
- IPC分类号： B08B6/00
摘要：
Disclosed is a high pressure processing method for subjecting a processing object to a high pressure processing using a high pressure fluid. In this method, the high pressure fluid is brought into collision with the surface of the processing object placed in a high pressure processing chamber, and then distributed along the surface of the processing object in an outward direction beyond the processing object.
公开/授权文献
- US20040123484A1 High pressure processing method and apparatus 公开/授权日：2004-07-01
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