Invention Grant
US07523848B2 Method and apparatus for measuring the size of free air balls on a wire bonder
失效
用于测量引线接合机上游离气球尺寸的方法和装置
- Patent Title: Method and apparatus for measuring the size of free air balls on a wire bonder
- Patent Title (中): 用于测量引线接合机上游离气球尺寸的方法和装置
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Application No.: US11148540Application Date: 2005-06-09
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Publication No.: US07523848B2Publication Date: 2009-04-28
- Inventor: David T. Beatson , Deepak Sood , Norman Lucas , Zhijie Wang
- Applicant: David T. Beatson , Deepak Sood , Norman Lucas , Zhijie Wang
- Applicant Address: US PA Fort Washington
- Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee Address: US PA Fort Washington
- Agent Christopher M. Spletzer, Sr.
- Main IPC: B23K31/02
- IPC: B23K31/02 ; G01B11/00
Abstract:
A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.
Public/Granted literature
- US20050284914A1 Method and apparatus for measuring the size of free air balls on a wire bonder Public/Granted day:2005-12-29
Information query
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