发明授权
- 专利标题： Semiconductor device and its manufacturing method
- 专利标题（中）： 半导体器件及其制造方法
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申请号： US10519785申请日： 2003-05-30
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公开(公告)号： US07525184B2公开(公告)日： 2009-04-28
- 发明人: Yoshihiko Shimanuki , Yoshihiro Suzuki , Koji Tsuchiya
- 申请人： Yoshihiko Shimanuki , Yoshihiro Suzuki , Koji Tsuchiya
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Miles & Stockbridge P.C.
- 优先权： JP2002-191666 20020701
- 国际申请： PCT/JP03/06830 WO 20030530
- 国际公布： WO2004/004005 WO 20040108
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/02
摘要：
There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.
公开/授权文献
- US20060017143A1 Semiconductor device and its manufacturing method 公开/授权日：2006-01-26
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