发明授权
- 专利标题： Heat dissipating device with preselected designed interface for thermal interface materials
- 专利标题（中）： 散热装置，具有预先设计的热界面材料接口
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申请号： US10612834申请日： 2003-06-30
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公开(公告)号： US07527090B2公开(公告)日： 2009-05-05
- 发明人: Ashay A. Dani , Sabina J. Houle , Christopher L. Rumer , Thomas J Fitzgerald
- 申请人： Ashay A. Dani , Sabina J. Houle , Christopher L. Rumer , Thomas J Fitzgerald
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.
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