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1.发明授权Heat dissipating device with preselected designed interface for thermal interface materials 有权散热装置，具有预先设计的热界面材料接口公开(公告)号：US07996989B2
公开(公告)日：2011-08-16
申请号：US12061694
申请日：2008-04-03
IPC分类号： H05K7/20
CPC分类号： H01L23/10 , H01L23/367 , H01L23/42 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/45099 , H01L2224/48091 , H01L2224/49109 , H01L2224/73253 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152 , H01L2924/1616 , H01L2924/16195 , H01L2924/3011 , Y10T29/4935 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.
摘要翻译： 本发明的实施例包括散热装置。 散热装置包括具有表面的主体，其中表面被镀覆或涂覆有至少两种不同的金属，以形成有效地焊接到焊料并且用于粘附到聚合物焊料混合物中的聚合物的设计。 散热装置还包括表面扰动。
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2.发明授权Heat dissipating device with preselected designed interface for thermal interface materials 失效散热装置，具有预先设计的热界面材料接口公开(公告)号：US07527090B2
公开(公告)日：2009-05-05
申请号：US10612834
申请日：2003-06-30
IPC分类号： H05K7/20
CPC分类号： H01L23/10 , H01L23/367 , H01L23/42 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/45099 , H01L2224/48091 , H01L2224/49109 , H01L2224/73253 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152 , H01L2924/1616 , H01L2924/16195 , H01L2924/3011 , Y10T29/4935 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.
摘要翻译： 本发明的实施例包括散热装置。 散热装置包括具有表面的主体，其中表面被镀覆或涂覆有至少两种不同的金属，以形成有效地焊接到焊料并且用于粘附到聚合物焊料混合物中的聚合物的设计。 散热装置还包括表面扰动。
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3.发明申请HEAT DISSIPATING DEVICE WITH PRESELECTED DESIGNED INTERFACE FOR THERMAL INTERFACE MATERIALS 有权具有预先设计的用于热界面材料的界面的散热装置公开(公告)号：US20080185713A1
公开(公告)日：2008-08-07
申请号：US12061694
申请日：2008-04-03
CPC分类号： H01L23/10 , H01L23/367 , H01L23/42 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/45099 , H01L2224/48091 , H01L2224/49109 , H01L2224/73253 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152 , H01L2924/1616 , H01L2924/16195 , H01L2924/3011 , Y10T29/4935 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.
摘要翻译： 本发明的实施例包括散热装置。 散热装置包括具有表面的主体，其中表面被镀覆或涂覆有至少两种不同的金属，以形成有效地焊接到焊料并且用于粘附到聚合物焊料混合物中的聚合物的设计。 散热装置还包括表面扰动。
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4.发明授权Thermal interface material and electronic assembly having such a thermal interface material 有权热界面材料和具有这种热界面材料的电子组件公开(公告)号：US07311967B2
公开(公告)日：2007-12-25
申请号：US10038334
申请日：2001-10-18
CPC分类号： H01L24/29 , H01L23/3737 , H01L23/42 , H01L2224/16225 , H01L2224/16227 , H01L2224/29 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29309 , H01L2224/29311 , H01L2224/29324 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/29393 , H01L2224/32245 , H01L2224/73253 , H01L2924/0001 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/0135 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/16152 , Y10S428/913 , Y10T428/1225 , Y10T428/12701 , Y10T428/12896 , Y10T428/25 , Y10T428/252 , Y10T428/256 , Y10T428/257 , Y10T428/258 , Y10T428/2982 , Y10T428/31511 , Y10T428/31529 , Y10T428/31663 , Y10T428/31692 , H01L2924/00 , H01L2924/01022 , H01L2924/01034 , H01L2924/01083 , H01L2224/29099 , H01L2924/00014 , H01L2924/0503 , H01L2924/05032 , H01L2924/04642 , H01L2924/05432 , H01L2224/29199 , H01L2224/29299
摘要： A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157° C. for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961° C. for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.
摘要翻译： 描述了热界面材料用于将电子部件热耦合到导热部件。 热界面材料包括粘弹性聚合物基质材料，基质材料中的易熔焊料颗粒和基质材料中的填料颗粒。 焊料颗粒具有低于所选温度（例如铟的157℃）的熔融温度，并且填料颗粒具有基本上高于所选温度（例如银的961℃）的熔融温度。 填料颗粒在不利的热和应力条件下保持热界面材料完好无损。
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5.发明授权Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials 有权凝胶热界面材料包括具有低熔点的填料和包含这些凝胶热界面材料的电子封装公开(公告)号：US06841867B2
公开(公告)日：2005-01-11
申请号：US10334241
申请日：2002-12-30
IPC分类号： H01L23/31 , H01L23/373 , H01L23/42 , H01L23/10 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/3737 , H01L23/3128 , H01L23/42 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/01078 , H01L2924/10253 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011 , H01L2924/00
摘要： A composition including an amount of at least one vinyl terminated polymer; an amount of at least one cross-linker comprising a terminal Si—H unit; an amount of at least one thermally conductive first filler, and at least one thermally conductive second filler, wherein a melting point of the first filler is greater than the melting point of the second filler. An apparatus including a package configured to mate with a printed circuit board; a semiconductor device coupled to the package; a thermal element; and a curable thermal material disposed between the thermal element and the semiconductor device.
摘要翻译： 包含至少一种乙烯基封端的聚合物的组合物; 至少一个包含末端Si-H单元的交联剂的量; 一定量的至少一种导热第一填料和至少一种导热第二填料，其中第一填料的熔点大于第二填料的熔点。 一种包括被配置为与印刷电路板匹配的封装的设备; 耦合到所述封装的半导体器件; 热元件; 以及设置在所述热元件和所述半导体器件之间的可固化热敏材料。
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公开(公告)号：US06974723B2
公开(公告)日：2005-12-13
申请号：US10956162
申请日：2004-09-30
IPC分类号： H01L23/31 , H01L23/373 , H01L23/42 , H01L29/866
CPC分类号： H01L23/3737 , H01L23/3128 , H01L23/42 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/01078 , H01L2924/10253 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011 , H01L2924/00
摘要： A composition including an amount of at least one vinyl terminated polymer; an amount of at least one cross-linker comprising a terminal Si—H unit; an amount of at least one thermally conductive first filler, and at least one thermally conductive second filler, wherein a melting point of the first filler is greater than the melting point of the second filler. An apparatus including a package configured to mate with a printed circuit board; a semiconductor device coupled to the package; a thermal element; and a curable thermal material disposed between the thermal element and the semiconductor device.
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公开(公告)号：US07304381B2
公开(公告)日：2007-12-04
申请号：US11461803
申请日：2006-08-02
IPC分类号： H01L23/34
CPC分类号： H01L23/40 , H01L23/4006 , H01L23/4093 , H01L2023/4062 , H01L2023/4087 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/16251 , H01L2924/19105 , H01L2924/19106 , H01L2924/00012 , H01L2224/0401
摘要： In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate with fasteners rather than a sealant-adhesive. Some examples of suitable fasteners may include rivets, barbed connectors, and gripping clips.
摘要翻译： 在一些实施例中，集成电路封装包括基板和通过紧固件联接到基板的散热器。 热界面材料将模具热耦合到散热器上。 散热器设置在模具上并且用紧固件而不是密封剂粘合剂附接到基板。 合适的紧固件的一些示例可以包括铆钉，带倒钩的连接器和夹紧夹。
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8.发明授权Method to compensate for stress between heat spreader and thermal interface material 有权弥补散热器和热界面材料之间应力的方法公开(公告)号：US06748350B2
公开(公告)日：2004-06-08
申请号：US09963438
申请日：2001-09-27
IPC分类号： G06G748
CPC分类号： H01L23/3675 , H01L23/34 , H01L2224/73204 , H01L2224/73253 , H01L2924/16152
摘要： A device and method identify and compensate for tensile and/or shear stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method may change the shape of the integrated heat spreader based upon the identification of location(s) of high tensile and/or shear stress so that additional thermal interface material may be deposited between the integrated heat spreader and a die in corresponding locations. Utilizing this method and device, heat is efficiently transferred from the die to the integrated heat spreader.
摘要翻译： 一种装置和方法识别和补偿由于集成散热器和热界面材料之间的热引起的膨胀和收缩引起的拉伸和/或剪切应力。 该装置和方法可以基于识别高拉伸和/或剪切应力的位置来改变集成散热器的形状，使得额外的热界面材料可以沉积在集成的散热器和相应位置的模具之间 。 利用该方法和装置，将热量从模具有效地传递到集成散热器。
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9.发明授权Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly 有权集成散热器，散热器或具有预附加相变热界面材料的热管和制造电子组件的方法公开(公告)号：US07846778B2
公开(公告)日：2010-12-07
申请号：US10261676
申请日：2002-10-02
CPC分类号： H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.
摘要翻译： 具有预先附着的相变热界面材料的集成散热器，散热器或热管以及制造电子组件的方法。
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10.发明授权Apparatus to compensate for stress between heat spreader and thermal interface material 有权用于补偿散热器和热界面材料之间的应力的装置公开(公告)号：US07358606B2
公开(公告)日：2008-04-15
申请号：US10857303
申请日：2004-05-28
IPC分类号： H01L23/34
CPC分类号： H01L23/3675 , H01L23/34 , H01L2224/73204 , H01L2224/73253 , H01L2924/16152
摘要： A device and method identify and compensate for tensile stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method change the shape of the integrated heat spreader based upon the identification of the location of the highest tensile and/or shear stress so that additional thermal interface material is deposited between the integrated heat spreader and a die. Utilizing this method and device, heat is efficiently transferred from the die to the integrated heat spreader.
摘要翻译： 一种装置和方法识别和补偿由于集成散热器和热界面材料之间的热引起的膨胀和收缩引起的拉伸应力。 该装置和方法基于识别最高拉伸和/或剪切应力的位置来改变集成散热器的形状，使得额外的热界面材料沉积在集成散热器和模具之间。 利用该方法和装置，将热量从模具有效地传递到集成散热器。
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