Invention Grant
- Patent Title: Resin solution and method of forming a protection layer
- Patent Title (中): 树脂溶液和形成保护层的方法
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Application No.: US10862338Application Date: 2004-06-08
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Publication No.: US07528188B2Publication Date: 2009-05-05
- Inventor: Seok Bong Park , Myung Sun Kim , Won Mi Kim , Jae Hyun Kim , Sang Sik Moon , Chang Ho Lee , Young Hoon Kim
- Applicant: Seok Bong Park , Myung Sun Kim , Won Mi Kim , Jae Hyun Kim , Sang Sik Moon , Chang Ho Lee , Young Hoon Kim
- Applicant Address: KR Suwon
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2003-0073526 20031021
- Main IPC: C08K5/10
- IPC: C08K5/10 ; C08K5/09 ; C08L71/10

Abstract:
A resin solution usable for forming a protection layer, including an organic solvent and a resol resin. The resin solution may further include any combination of a cross-linking agene or agent(s), a photo active compound (PAC) or compounds(s), and/or development accelerator or accelerator(s) a method forming a cured resin layer, including applying a resin solution, including a resol resin, directly or indirectly on a substrate and hard baking the resin solution to form the cured resin layer. The resin solution may include a resol resin and/or a novolac resin.
Public/Granted literature
- US20050085587A1 Resin solution and method of forming a protection layer Public/Granted day:2005-04-21
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