Invention Grant
US07528404B2 Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality
失效
使用具有电子给体或受体功能的恶唑啉衍生物装配到基底上的半导体管芯
- Patent Title: Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality
- Patent Title (中): 使用具有电子给体或受体功能的恶唑啉衍生物装配到基底上的半导体管芯
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Application No.: US10555291Application Date: 2004-02-17
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Publication No.: US07528404B2Publication Date: 2009-05-05
- Inventor: Osama M. Musa , Ruzhi Zhang
- Applicant: Osama M. Musa , Ruzhi Zhang
- Applicant Address: DE Düsseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Düsseldorf
- Agent Jane E. Gennaro
- International Application: PCT/US2004/004736 WO 20040217
- International Announcement: WO2005/083771 WO 20050909
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L35/24 ; H01L51/00
Abstract:
An assembly of a semiconductor die attached to a substrate is made with a composition comprising compounds that contain an oxazoline functionality and an electron acceptor or an electron donor functionality. Electron donor functionalities include styrenic, cinnamyl, and vinyl ether groups. Electron acceptor functionalities include maleimide, acrylate, fumarate, and maleate groups. An exemplary compound has the structure: formula (I).
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