发明授权
- 专利标题: Low tunneling current MIM structure and method of manufacturing same
- 专利标题(中): 低隧道电流MIM结构及其制造方法
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申请号: US11379478申请日: 2006-04-20
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公开(公告)号: US07529078B2公开(公告)日: 2009-05-05
- 发明人: Yu-Jen Wang , Hsing-Lien Lin , Yeur-Luen Tu
- 申请人: Yu-Jen Wang , Hsing-Lien Lin , Yeur-Luen Tu
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Baker & McKenzie LLP
- 主分类号: H01G4/38
- IPC分类号: H01G4/38
摘要:
Disclosed herein are new MIM structures having increased capacitance with little or no tunneling current, and related methods of manufacturing the same. In one embodiment, the new MIM structure comprises a first electrode comprising a magnetic metal and having a magnetic moment aligned in a first direction, and a second electrode comprising a magnetic metal and having a magnetic moment aligned in a second direction antiparallel to the first direction. In addition, such an MIM structure comprises a dielectric layer formed between the first and second electrodes and contacting the first and second magnetic metals.
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