Invention Grant
- Patent Title: Interleaver
- Patent Title (中): 交织器
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Application No.: US11093743Application Date: 2005-03-30
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Publication No.: US07529307B2Publication Date: 2009-05-05
- Inventor: Sumeet Sandhu , David Cheung
- Applicant: Sumeet Sandhu , David Cheung
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Agent Gregory J. Gorrie
- Main IPC: H04K1/10
- IPC: H04K1/10 ; H04L27/28

Abstract:
An interleaver and scheme for interleaving in which highly correlated bits are maximally separated. The scheme involves interleaving a set of bits to be delivered to a modulation system that utilizes a quantity of N carrier frequencies. A first block of N consecutive bits is assigned to each of N bins, on a one-bit-per-one-bin basis. The aforementioned assignment proceeds in a particular sequence. A second block of N consecutive bits is assigned to each of the N bins, on a one-bit-per-one-bin basis. The second block is assigned in the same sequence the first block was assigned. The second block is consecutive to the first block.
Public/Granted literature
- US20060242475A1 Interleaver Public/Granted day:2006-10-26
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