发明授权
US07533459B2 Electronic component mounting method and electronic component mounting apparatus 有权
电子部件安装方法和电子部件安装装置

Electronic component mounting method and electronic component mounting apparatus
摘要:
The invention is directed to increased stabilization of a pickup operation by reducing a reaction against disturbance by reducing a feedback value when a pickup rate is improved. A positional shifting amount of an electronic component on a suction nozzle before the electronic component is mounted on a printed board is stored in a RAM each time the component is picked up at a component feeding unit until a pickup count number reaches a predetermined pickup number, and a CPU calculates an average of the positional shifting amounts. When the pickup count number reaches the predetermined pickup number, the CPU obtains a temporary coefficient by adding an initial value to a value obtained by multiplying a negative coefficient by the pickup count number, and calculates a feedback value by multiplying the temporary coefficient by the average. The calculated feedback value is added to an offset value of a component pickup position to modify the offset value, and uses the offset value in the next pickup operation at the component feeding unit.
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