Invention Grant
- Patent Title: Electronic component mounting method and electronic component mounting apparatus
- Patent Title (中): 电子部件安装方法和电子部件安装装置
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Application No.: US11113318Application Date: 2005-04-25
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Publication No.: US07533459B2Publication Date: 2009-05-19
- Inventor: Yoshinori Kano , Takeshi Tomifuku , Yoshinori Okamoto , Yoshinao Usui , Ikuo Takemura
- Applicant: Yoshinori Kano , Takeshi Tomifuku , Yoshinori Okamoto , Yoshinao Usui , Ikuo Takemura
- Applicant Address: JP Gunma
- Assignee: Hitachi High-Tech Instruments, Co., Ltd.
- Current Assignee: Hitachi High-Tech Instruments, Co., Ltd.
- Current Assignee Address: JP Gunma
- Agency: Morrison & Foerster LLP
- Priority: JP2004-131300 20040427
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
The invention is directed to increased stabilization of a pickup operation by reducing a reaction against disturbance by reducing a feedback value when a pickup rate is improved. A positional shifting amount of an electronic component on a suction nozzle before the electronic component is mounted on a printed board is stored in a RAM each time the component is picked up at a component feeding unit until a pickup count number reaches a predetermined pickup number, and a CPU calculates an average of the positional shifting amounts. When the pickup count number reaches the predetermined pickup number, the CPU obtains a temporary coefficient by adding an initial value to a value obtained by multiplying a negative coefficient by the pickup count number, and calculates a feedback value by multiplying the temporary coefficient by the average. The calculated feedback value is added to an offset value of a component pickup position to modify the offset value, and uses the offset value in the next pickup operation at the component feeding unit.
Public/Granted literature
- US20050250223A1 Electronic component mounting method and electronic component mounting apparatus Public/Granted day:2005-11-10
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