发明授权
US07534659B2 Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device
失效
硅酮系粘合片，将半导体芯片接合到芯片安装部件的方法以及半导体装置
- 专利标题： Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device
- 专利标题（中）： 硅酮系粘合片，将半导体芯片接合到芯片安装部件的方法以及半导体装置
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申请号： US10521287申请日： 2003-07-14
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公开(公告)号： US07534659B2公开(公告)日： 2009-05-19
- 发明人: Manabu Sutoh , Yoshito Ushio , Toyohiko Fujisawa , Katsutoshi Mine
- 申请人： Manabu Sutoh , Yoshito Ushio , Toyohiko Fujisawa , Katsutoshi Mine
- 申请人地址： JP Tokyo
- 专利权人： Dow Corning Toray Silicone Company, Ltd.
- 当前专利权人： Dow Corning Toray Silicone Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Howard & Howard Attorneys PLLC
- 优先权： JP2002-205869 20020715
- 国际申请： PCT/JP03/08936 WO 20030714
- 国际公布： WO2004/007628 WO 20040122
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; C08G77/12 ; C08G77/20 ; C08G77/04
摘要：
A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first composition layer on the other side, or a cured silicone layer on one side and a layer of clay-like curable silicone composition on the other side. The silicone-based adhesive sheet may be used in a method for bonding semiconductor chip and a chip attachment component. A semiconductor device may be prepared by the method.
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