发明授权
US07535073B2 Solid-state imaging device, camera module and electronic equipment module
有权
固态成像装置,相机模块和电子设备模块
- 专利标题: Solid-state imaging device, camera module and electronic equipment module
- 专利标题(中): 固态成像装置,相机模块和电子设备模块
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申请号: US11208960申请日: 2005-08-22
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公开(公告)号: US07535073B2公开(公告)日: 2009-05-19
- 发明人: Takayuki Ezaki
- 申请人: Takayuki Ezaki
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Sonnenschein Nath & Rosenthal LLP
- 优先权: JPP2004-253590 20040831
- 主分类号: H01L31/00
- IPC分类号: H01L31/00 ; H01L31/0232 ; H01L31/06
摘要:
To provide a back-illuminated type solid-state imaging device capable of color separation of pixels without using a color filter, and a camera module and an electronic equipment module which incorporate the solid-state imaging device. A solid-state imaging device including: a photoelectric conversion element PD formed in a semiconductor substrate 22; a reading-out part which reads out signal charges from the photoelectric conversion element PD formed on one surface side of the semiconductor substrate 22; the other surface of the semiconductor substrate 22 made to a light incidence surface; and a pixel which exclusively makes light of a specific wavelength or longer photoelectrically converted, by adjusting pn junction depths h2 [h2 r, h2 g, h2 b] between the photoelectric conversion element PD and an accumulation layer 28 on the light incidence surface side. A camera module and an electronic equipment module which incorporate the solid-state imaging device.
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