发明授权
- 专利标题： Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same
- 专利标题（中）： 具有贯通衬底电气连接的电容式微加工超声波换能器阵列及其制造方法
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申请号： US11144184申请日： 2005-06-04
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公开(公告)号： US07545075B2公开(公告)日： 2009-06-09
- 发明人: Yongli Huang , Xuefeng Zhuang , Butrus T. Khuri-Yakub , Ching-Hsiang Cheng , Arif S. Ergun
- 申请人： Yongli Huang , Xuefeng Zhuang , Butrus T. Khuri-Yakub , Ching-Hsiang Cheng , Arif S. Ergun
- 申请人地址： US CA Palo Alto
- 专利权人： The Board of Trustees of the Leland Stanford Junior University
- 当前专利权人： The Board of Trustees of the Leland Stanford Junior University
- 当前专利权人地址： US CA Palo Alto
- 代理机构： Perkins Coie, LLP
- 主分类号： H02N1/00
- IPC分类号： H02N1/00 ; H04R19/00
摘要：
The embodiments of the present invention provide a CMUT array and method of fabricating the same. The CMUT array has CMUT elements individually or respectively addressable from a backside of a substrate on which the CMUT array is fabricated. In one embodiment, a CMUT array is formed on a front side of a very high conductivity silicon substrate. Through wafer trenches are etched into the substrate from the backside of the substrate to electrically isolate individual CMUT elements formed on the front side of the substrate. Electrodes are formed on the backside of the substrate to individually address the CMUT elements through the substrate.
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