发明授权
- 专利标题： Method of maintaining and automatically inspecting processing apparatus
- 专利标题（中）： 维护和自动检查处理设备的方法
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申请号： US10986310申请日： 2004-11-12
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公开(公告)号： US07555406B2公开(公告)日： 2009-06-30
- 发明人: Hisato Tanaka , Akira Obi , Akira Iwami , Kazushi Tahara , Shigeaki Kato
- 申请人： Hisato Tanaka , Akira Obi , Akira Iwami , Kazushi Tahara , Shigeaki Kato
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权： JP2000-206430 20000707; JP2000-222615 20000724; JP2000-222622 20000724
- 主分类号： G06F11/34
- IPC分类号： G06F11/34
摘要：
According to the present invention, as processing apparatus drive starts, the operating state of software used to drive the processing apparatus is monitored in real time to diagnose whether or not an abnormality has occurred (S110). If it is judged through the diagnosis performed in S110 that no abnormality has occurred, the workpiece processing is allowed to continue uninterrupted and then a decision is made as to whether or not the workpiece processing has been completed (S130). If the processing has been completed, the processing apparatus is stopped (S140). If, on the other hand, it is judged through the diagnosis performed in S110 that an abnormality has occurred, a log of the diagnosis item with regard to which the abnormality has occurred is recorded (S120). The processing apparatus is then stopped (S140).
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