Invention Grant
US07559527B2 Diffusion bonded fluid flow manifold with partially integrated inter-active component
失效
具有部分集成的相互作用部件的扩散粘合流体流动歧管
- Patent Title: Diffusion bonded fluid flow manifold with partially integrated inter-active component
- Patent Title (中): 具有部分集成的相互作用部件的扩散粘合流体流动歧管
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Application No.: US11788428Application Date: 2007-04-19
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Publication No.: US07559527B2Publication Date: 2009-07-14
- Inventor: Mark Crockett , John W. Lane , Micahel DeChellis , Chris Melcer , Erica Porras , Aneesh Khullar , Balarabe N. Mohammed
- Applicant: Mark Crockett , John W. Lane , Micahel DeChellis , Chris Melcer , Erica Porras , Aneesh Khullar , Balarabe N. Mohammed
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Shirley L. Church
- Main IPC: F16K31/00
- IPC: F16K31/00
Abstract:
A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
Public/Granted literature
- US20070226973A1 Diffusion bonded fluid flow manifold with partially integrated inter-active component Public/Granted day:2007-10-04
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