发明授权
- 专利标题: Apparatus and method for impedance matching in a backplane signal channel
- 专利标题(中): 背板信号通道中阻抗匹配的装置和方法
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申请号: US11313333申请日: 2005-12-21
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公开(公告)号: US07564694B2公开(公告)日: 2009-07-21
- 发明人: Xingjian Cai , Xiao-Ming Gao , Qing-Iun Chen
- 申请人: Xingjian Cai , Xiao-Ming Gao , Qing-Iun Chen
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: H05K1/18
- IPC分类号: H05K1/18
摘要:
An apparatus comprising a printed circuit board having a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal channels; a stub extending from the front side to the back side, the stub being electrically coupled to at least one signal channel; and an impedance matching terminal electrically coupled to the stub and to a ground. A process comprising providing a printed circuit board including a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal channels, and a stub extending from the front side to the back side, the stub being electrically coupled to at least one signal channel and being designed to receive a signal from a component attached to the printed circuit board; and coupling an impedance matching terminal to the stub and to a ground.
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