Apparatus and method for impedance matching in a backplane signal channel
    1.
    发明授权
    Apparatus and method for impedance matching in a backplane signal channel 有权
    背板信号通道中阻抗匹配的装置和方法

    公开(公告)号:US07564694B2

    公开(公告)日:2009-07-21

    申请号:US11313333

    申请日:2005-12-21

    IPC分类号: H05K1/18

    摘要: An apparatus comprising a printed circuit board having a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal channels; a stub extending from the front side to the back side, the stub being electrically coupled to at least one signal channel; and an impedance matching terminal electrically coupled to the stub and to a ground. A process comprising providing a printed circuit board including a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal channels, and a stub extending from the front side to the back side, the stub being electrically coupled to at least one signal channel and being designed to receive a signal from a component attached to the printed circuit board; and coupling an impedance matching terminal to the stub and to a ground.

    摘要翻译: 一种装置,包括具有前侧和后侧的印刷电路板,并且其中具有多个导电层,每个导电层包括一个或多个信号通道; 从前侧延伸到后侧的短截线,短截线电耦合到至少一个信号通道; 以及电阻耦合到短截线和接地的阻抗匹配端子。 一种包括提供包括前侧和后侧的印刷电路板的工艺,其中包括多个导电层,每个导电层包括一个或多个信号通道,以及从前侧向后侧延伸的短截线 短截线被电耦合到至少一个信号通道并且被设计成从附接到印刷电路板的部件接收信号; 并将阻抗匹配端子耦合到短截线和接地。

    Apparatus and method for impedance matching in a backplane signal channel
    2.
    发明申请
    Apparatus and method for impedance matching in a backplane signal channel 有权
    背板信号通道中阻抗匹配的装置和方法

    公开(公告)号:US20070139063A1

    公开(公告)日:2007-06-21

    申请号:US11313333

    申请日:2005-12-21

    IPC分类号: G01R31/02

    摘要: An apparatus comprising a printed circuit board having a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal channels; a stub extending from the front side to the back side, the stub being electrically coupled to at least one signal channel; and an impedance matching terminal electrically coupled to the stub and to a ground. A process comprising providing a printed circuit board including a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal channels, and a stub extending from the front side to the back side, the stub being electrically coupled to at least one signal channel and being designed to receive a signal from a component attached to the printed circuit board; and coupling an impedance matching terminal to the stub and to a ground.

    摘要翻译: 一种装置,包括具有前侧和后侧的印刷电路板,并且其中具有多个导电层,每个导电层包括一个或多个信号通道; 从前侧延伸到后侧的短截线,短截线电耦合到至少一个信号通道; 以及电阻耦合到短截线和接地的阻抗匹配端子。 一种包括提供包括前侧和后侧的印刷电路板的工艺,其中包括多个导电层,每个导电层包括一个或多个信号通道,以及从前侧向后侧延伸的短截线 短截线被电耦合到至少一个信号通道并且被设计成从附接到印刷电路板的部件接收信号; 并将阻抗匹配端子耦合到短截线和接地。