Invention Grant
- Patent Title: Apparatus and method for impedance matching in a backplane signal channel
- Patent Title (中): 背板信号通道中阻抗匹配的装置和方法
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Application No.: US11313333Application Date: 2005-12-21
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Publication No.: US07564694B2Publication Date: 2009-07-21
- Inventor: Xingjian Cai , Xiao-Ming Gao , Qing-Iun Chen
- Applicant: Xingjian Cai , Xiao-Ming Gao , Qing-Iun Chen
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H05K1/18
- IPC: H05K1/18

Abstract:
An apparatus comprising a printed circuit board having a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal channels; a stub extending from the front side to the back side, the stub being electrically coupled to at least one signal channel; and an impedance matching terminal electrically coupled to the stub and to a ground. A process comprising providing a printed circuit board including a front side and a back side, and having therein a plurality of conductive layers, each conductive layer including one or more signal channels, and a stub extending from the front side to the back side, the stub being electrically coupled to at least one signal channel and being designed to receive a signal from a component attached to the printed circuit board; and coupling an impedance matching terminal to the stub and to a ground.
Public/Granted literature
- US20070139063A1 Apparatus and method for impedance matching in a backplane signal channel Public/Granted day:2007-06-21
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