发明授权
- 专利标题： Composition for removing an insulation material and related methods
- 专利标题（中）： 去除绝缘材料的组成和相关方法
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申请号： US11500434申请日： 2006-08-08
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公开(公告)号： US07566666B2公开(公告)日： 2009-07-28
- 发明人: Chun-Deuk Lee , Jung-Jea Myung , Myun-Kyu Park , Dong-Min Kang , Byoung-Woo Son , Masayuki Takashima , Young-Nam Kim , Hyun-Joon Kim
- 申请人： Chun-Deuk Lee , Jung-Jea Myung , Myun-Kyu Park , Dong-Min Kang , Byoung-Woo Son , Masayuki Takashima , Young-Nam Kim , Hyun-Joon Kim
- 申请人地址： KR Suwon-si, Gyeonggi-do KR Iksan-si, Jeollabuk-do
- 专利权人： Samsung Electronics Co., Ltd.,Dongwoo Fine-Chem Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.,Dongwoo Fine-Chem Co., Ltd.
- 当前专利权人地址： KR Suwon-si, Gyeonggi-do KR Iksan-si, Jeollabuk-do
- 代理机构： Volentine & Whitt, PLLC
- 优先权： KR10-2005-0072471 20050808
- 主分类号： H01L21/461
- IPC分类号： H01L21/461
摘要：
A composition for removing an insulation material and related methods of use are disclosed. The composition comprises about 1 to 50 percent by weight of an oxidizing agent, about 0.1 to 35 percent by weight of a fluorine-containing compound, and water. The insulation material comprises at least one of a low-k material and a protection material.
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