Invention Grant
- Patent Title: Method and device for connecting chips
- Patent Title (中): 连接芯片的方法和装置
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Application No.: US10577142Application Date: 2004-10-28
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Publication No.: US07569940B2Publication Date: 2009-08-04
- Inventor: Francois Marion
- Applicant: Francois Marion
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique
- Current Assignee: Commissariat a l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Priority: FR0350774 20031103
- International Application: PCT/FR2004/050549 WO 20041028
- International Announcement: WO2005/045934 WO 20050519
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L29/40
Abstract:
The invention relates to an electronic device comprising: a circuit, comprising a first and a second face, the first face being provided with electrical connection means, a transfer element, comprising a first face and a second face, and being assembled to the second face of the active element through its first face, and comprising electrical connection means on its second face, a connection between the electrical connection means of the active element and the electrical connection means of the transfer element.
Public/Granted literature
- US20070111567A1 Method and device for connecting chips Public/Granted day:2007-05-17
Information query
IPC分类:
