发明授权
- 专利标题： Circuit board, multi-layer wiring boards, method of producing circuit boards and method of producing multilayer wiring boards
- 专利标题（中）： 电路板，多层布线板，电路板的制造方法以及多层布线板的制造方法
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申请号： US10534962申请日： 2003-11-19
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公开(公告)号： US07576288B2公开(公告)日： 2009-08-18
- 发明人: Masayoshi Kondo , Masaaki Kato , Toshiaki Chuma , Satoru Nakao , Kentaro Fujiura
- 申请人： Masayoshi Kondo , Masaaki Kato , Toshiaki Chuma , Satoru Nakao , Kentaro Fujiura
- 申请人地址： JP
- 专利权人： Sumitomo Bakelite Company Limited
- 当前专利权人： Sumitomo Bakelite Company Limited
- 当前专利权人地址： JP
- 代理机构： Smith Gambrell & Russell
- 优先权： JP2002-344568 20021127
- 国际申请： PCT/JP03/14741 WO 20031119
- 国际公布： WO2004/049772 WO 20040610
- 主分类号： H05K1/00
- IPC分类号： H05K1/00
摘要：
A multilayer flexible wiring board including (1) plural single-sided wiring boards each having a wiring pattern on one side of the corresponding substrate and two-layer conductor posts projecting from the wiring pattern to the side of the substrate opposite from the wiring pattern, wherein the substrates other than that of the outermost layer have the pads to be connected to the two-layer conductor posts on the side opposite from the conductor posts, and the wiring pattern has no surface coating; (2) a flexible wiring board having on at least one side thereof the pads for connection to the conductor posts and including a wiring pattern with surface coating applied on the flexible portion but no surface coating applied on the multilayer portion, and (3) an adhesive layer having a flux function, wherein the conductor posts and pads are connected by a metal or an alloy, and the wiring patterns are electrically connected.