公开(公告)号：US07576288B2

公开(公告)日：2009-08-18

申请号：US10534962

申请日：2003-11-19

申请人： Masayoshi Kondo ,  Masaaki Kato ,  Toshiaki Chuma ,  Satoru Nakao ,  Kentaro Fujiura

发明人： Masayoshi Kondo ,  Masaaki Kato ,  Toshiaki Chuma ,  Satoru Nakao ,  Kentaro Fujiura

IPC分类号： H05K1/00

CPC分类号： H05K3/4635 ,  H05K1/0393 ,  H05K3/3489 ,  H05K3/386 ,  H05K3/4602 ,  H05K3/4617 ,  H05K3/4691 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2203/0733 ,  H05K2203/1189

摘要： A multilayer flexible wiring board including (1) plural single-sided wiring boards each having a wiring pattern on one side of the corresponding substrate and two-layer conductor posts projecting from the wiring pattern to the side of the substrate opposite from the wiring pattern, wherein the substrates other than that of the outermost layer have the pads to be connected to the two-layer conductor posts on the side opposite from the conductor posts, and the wiring pattern has no surface coating; (2) a flexible wiring board having on at least one side thereof the pads for connection to the conductor posts and including a wiring pattern with surface coating applied on the flexible portion but no surface coating applied on the multilayer portion, and (3) an adhesive layer having a flux function, wherein the conductor posts and pads are connected by a metal or an alloy, and the wiring patterns are electrically connected.

摘要翻译： 一种多层柔性布线基板，包括：（1）多个单面布线板，其各自具有在相应基板的一侧上的布线图案和从该布线图案向与该布线图案相对的一侧突出的两层导体柱， 其中除了最外层之外的衬底具有与导体柱相反的一侧连接到两层导体柱的焊盘，并且布线图案没有表面涂层; （2）柔性布线板，其至少一侧具有用于连接到导体柱的焊盘，并且包括施加在柔性部分上的表面涂层的布线图案，但是没有施加在多层部分上的表面涂层，以及（3） 具有助焊剂功能的粘合剂层，其中导体柱和焊盘通​​过金属或合金连接，并且布线图案电连接。