公开(公告)号：US20120261174A1

公开(公告)日：2012-10-18

申请号：US13518798

申请日：2010-12-17

申请人： Toshiaki Chuma ,  Tomohiro Kagimoto

发明人： Toshiaki Chuma ,  Tomohiro Kagimoto

IPC分类号： H05K7/02 ,  B32B27/42 ,  B32B15/098 ,  B32B5/16 ,  H05K1/11 ,  F27D3/00

CPC分类号： H05K3/3478 ,  C08L63/00 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/1152 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/29083 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/2912 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/2916 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83205 ,  H01L2224/83222 ,  H01L2224/83801 ,  H01L2224/83862 ,  H01L2224/83885 ,  H01L2224/83886 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/3489 ,  H05K3/4007 ,  H05K2203/0405 ,  H05K2203/0425 ,  H05K2203/043 ,  Y10T428/25 ,  Y10T428/31678 ,  Y10T428/31688 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Disclosed is a conductive connecting material 30 used to form conductive portions on a plurality of terminals 11 of an electronic member having a substrate 10 and the plurality of terminals 11 provided on the substrate 10, comprising a metal layer 110 and a resin layer 120 having a resin component and a filler, in which the metal layer is aggregated on each of terminals to form the conductive portions on the plurality of terminals by bringing the conductive connecting material into contact with the plurality of terminals and heating the conductive connecting material.

摘要翻译： 公开了一种用于在具有基板10的电子部件的多个端子11上形成导电部分的导电连接材料30和设置在基板10上的多个端子11，其包括金属层110和具有 树脂组分和填料，其中通过使导电连接材料与多个端子接触并加热导电连接材料，金属层在每个端子上聚集以在多个端子上形成导电部分。

公开(公告)号：US08241760B2

公开(公告)日：2012-08-14

申请号：US12440986

申请日：2006-09-14

申请人： Toshiaki Chuma

发明人： Toshiaki Chuma

IPC分类号： B32B15/04 ,  B32B15/20 ,  H05K3/00 ,  B23K20/00 ,  H01R4/00 ,  H01R4/02

CPC分类号： H05K3/4617 ,  B23K1/0016 ,  B23K35/001 ,  B23K35/0238 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  C25D5/48 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/0269 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T29/49149 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12903

摘要： A joint structure of the present invention includes a conductive member containing copper as a major component thereof, an electrode member containing copper as a major component thereof, and a joint portion formed by fusion welding the conductive member and the electrode member with a brazing material containing tin as a major component thereof and containing substantially no copper, wherein the amount of copper atoms contained in the alloy in the central part of the joint portion is higher than that in the outer circumference part.

摘要翻译： 本发明的接合结构包括以铜为主要成分的导电构件，以铜为主要成分的电极构件和通过将导电构件和电极构件与含有 锡作为其主要组分并且基本上不含铜，其中在接合部分的中心部分中合金中包含的铜原子的量高于外周部分。

公开(公告)号：US08748751B2

公开(公告)日：2014-06-10

申请号：US13128338

申请日：2009-11-19

申请人： Toshiaki Chuma ,  Masayoshi Kondo ,  Satoshi Tanaka ,  Kenichi Kanemasa

发明人： Toshiaki Chuma ,  Masayoshi Kondo ,  Satoshi Tanaka ,  Kenichi Kanemasa

IPC分类号： H05K1/16

CPC分类号： H01L24/16 ,  H01L23/49816 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2221/68336 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/73104 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/351 ,  Y10T29/49124 ,  H01L2224/81 ,  H01L2224/13099 ,  H01L2924/00

摘要： Disclosed is an electronic component package (100) including a circuit board (10), an electronic component (20), and an adhesive layer (30). The circuit board (10) is provided with an electrically-conductive conductor post (16) which is buried in a base member (12), and a solder layer (18) which is provided at the front end (13) of the conductor post (16) while exposed from a surface (121) of the base member (12). An electrode pad (24) having a metal layer (22) mounted thereon is provided on the main surface (26) of the electronic component (20). The adhesive layer (30) contains a flux activating compound, and bonds the surface (121) of the base member (12) and the main surface (26) of the electronic component (20). Then, the metal layer (22) and the solder layer (18) are metal-bonded.

摘要翻译： 公开了一种电子部件封装（100），包括电路板（10），电子部件（20）和粘合剂层（30）。 电路板（10）设置有埋设在基底构件（12）中的导电导体柱（16），以及设置在导体柱的前端（13）处的焊料层（18） （16），同时从所述基底构件（12）的表面（121）暴露。 在电子部件（20）的主表面（26）上设置有安装有金属层（22）的电极焊盘（24）。 粘合剂层（30）含有助焊剂活化化合物，并与基体（12）的表面（121）和电子部件（20）的主表面（26）结合。 然后，金属层（22）和焊料层（18）金属结合。

公开(公告)号：US20090084597A1

公开(公告)日：2009-04-02

申请号：US12293264

申请日：2007-03-14

申请人： Toshiaki Chuma ,  Makoto Inaba

发明人： Toshiaki Chuma ,  Makoto Inaba

IPC分类号： H05K1/11

CPC分类号： H05K1/148 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481

摘要： There is provided a circuit board including a first and a second circuit substrate located with a spacing, on which a first and a second conductor pad are provided respectively; and a connection substrate including a first and a second conductor post projecting from one or the other side; the connection substrate being disposed so as to cover a portion of the first and the second circuit substrate, and bridged therebetween; the first conductor post and the first conductor pad, as well as the second conductor post and the second conductor pad, being disposed so as to oppose each other; the circuit board also including a connector portion to be formed upon melting a metal coating layer, formed in advance on a surface of at least one of the first conductor post and the first conductor pad, and on a surface of at least one of the second conductor post and the second conductor pad; the first and the second circuit substrate and the connection substrate being electrically connected through the connector portion.

摘要翻译： 提供了一种电路板，包括分别设置有第一和第二导体焊盘的间隔的第一和第二电路基板; 以及连接基板，包括从一侧或另一侧突出的第一和第二导体柱; 连接基板被设置成覆盖第一和第二电路基板的一部分，并在其间桥接; 第一导体柱和第一导体焊盘以及第二导体柱和第二导体焊盘彼此相对设置; 电路板还包括在熔化金属涂层时形成的连接器部分，其预先形成在第一导体柱和第一导体焊盘中的至少一个的表面上，并且在第二第二导体柱中的至少一个的表面上形成 导体柱和第二导体垫; 第一和第二电路基板和连接基板通过连接器部分电连接。

公开(公告)号：US20120214010A1

公开(公告)日：2012-08-23

申请号：US13503855

申请日：2010-10-27

申请人： Tomohiro Kagimoto ,  Toshiaki Chuma

发明人： Tomohiro Kagimoto ,  Toshiaki Chuma

IPC分类号： B32B15/08 ,  B23K1/20 ,  B32B15/082

CPC分类号： H01L24/29 ,  C09J7/22 ,  C09J7/28 ,  C09J7/35 ,  C09J2201/602 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2479/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83205 ,  H01L2224/83222 ,  H01L2224/83815 ,  H01L2224/83886 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/363 ,  H05K2201/10977 ,  H05K2203/0405 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T428/31678 ,  Y10T428/31699 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides a conductive connecting material having a multilayered structure comprising a resin composition (A) and a metal foil (B) selected from a solder foil or a tin foil, wherein the volume ratio ((A)/(B)) of the resin composition (A) and the metal foil (B) selected from a solder foil or a tin foil in the conductive connecting material is 1-40 or 20-500, as well as a method for connecting terminals using the conductive connecting material. The conductive connecting material of the present invention is preferably used for electrically connecting electronic members in an electrical or electronic component.

摘要翻译： 本发明提供一种具有多层结构的导电连接材料，其包含树脂组合物（A）和选自焊锡箔或锡箔的金属箔（B），其中体积比（（A）/（B）） 在导电连接材料中，选自焊锡箔或锡箔中的树脂组合物（A）和金属箔（B）为1-40或20-500，以及使用导电连接材料连接端子的方法。 本发明的导电连接材料优选用于将电子部件或电子部件中的电子部件电连接。

公开(公告)号：US20120183781A1

公开(公告)日：2012-07-19

申请号：US13498941

申请日：2010-09-29

申请人： Toshiaki Chuma ,  Wataru Okada ,  Tomohiro Kagimoto

发明人： Toshiaki Chuma ,  Wataru Okada ,  Tomohiro Kagimoto

IPC分类号： B32B15/04 ,  B32B37/12

CPC分类号： H05K3/3478 ,  C08G2650/56 ,  C08L33/08 ,  C08L63/00 ,  C08L71/00 ,  C08L79/08 ,  C09J7/22 ,  C09J7/28 ,  C09J7/35 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2463/00 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/111 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83222 ,  H01L2224/83856 ,  H01L2224/83886 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H01R13/03 ,  H05K3/305 ,  H05K3/363 ,  H05K2201/10977 ,  H05K2203/0405 ,  Y10T428/31529 ,  Y10T428/31678 ,  C08L2666/02 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/29113 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00015

摘要： The present invention provides a conductive connecting material having a multi-layered structure comprising a resin composition and a metal foil selected from a solder foil or a tin foil, wherein the minimum ion viscosity value of the resin composition is 4-9 when measured in accordance with ASTM standard E2039 by applying a frequency of 10000 Hz at the melting point of the metal foil. The present invention further provides a method for connecting terminals and a method for producing a connection terminal using the conductive connecting material. By using the conductive connecting material of the present invention, good electric connection between connection tell finals as well as highly-reliable insulation between adjacent terminals can be achieved.

摘要翻译： 本发明提供一种具有多层结构的导电性连接材料，其包含树脂组合物和选自焊锡箔或锡箔的金属箔，其中当按照下述方式测量时，树脂组合物的最小离子粘度值为4-9 通过在金属箔的熔点处施加10000Hz的频率，使用ASTM标准E2039。 本发明还提供了一种用于连接端子的方法和使用该导电连接材料制造连接端子的方法。 通过使用本发明的导电连接材料，可以实现连接之间的良好的电连接，并且可以实现相邻端子之间的高度可靠的绝缘。

公开(公告)号：US20110311790A1

公开(公告)日：2011-12-22

申请号：US13061952

申请日：2009-09-03

申请人： Wataru Okada ,  Michinori Yamamoto ,  Toshiaki Chuma ,  Kenzo Maejima ,  Tomohiro Kagimoto ,  Satoru Katsurayama ,  Tomoe Fujii

发明人： Wataru Okada ,  Michinori Yamamoto ,  Toshiaki Chuma ,  Kenzo Maejima ,  Tomohiro Kagimoto ,  Satoru Katsurayama ,  Tomoe Fujii

IPC分类号： B32B3/00 ,  H01R43/00 ,  B32B15/08 ,  B32B9/04 ,  B32B15/04 ,  B32B27/38

CPC分类号： H05K3/363 ,  C09J9/02 ,  C09J163/00 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/10977 ,  H05K2203/0405 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T428/24917 ,  Y10T428/31529 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692

摘要： The present invention provides a conductive connecting material for electrically connecting terminals of electronic members, which has a layered structure comprising: a curable resin composition containing a resin component and a compound having a flux function; and a metal foil selected from a solder foil and a tin foil. Further, the present invention provides a method for connecting terminals comprising: a placement step in which the conductive connecting material is placed between opposed terminals; a heating step in which the conductive connecting material is heated at a temperature, which is equal to or higher than the melting point of the metal foil, and at which the resin composition is not completely cured or the resin composition is softened; and a curing step/solidifying step in which the resin composition is cured or solidified.

摘要翻译： 本发明提供一种用于电连接电子部件端子的导电连接材料，其具有层状结构，包括：含有树脂成分和具有助焊剂功能的化合物的固化性树脂组合物; 以及选自焊锡箔和锡箔的金属箔。 此外，本发明提供一种连接端子的方法，包括：放置步骤，其中所述导电连接材料放置在相对的端子之间; 加热步骤，其中导电连接材料在等于或高于金属箔的熔点的温度下加热，并且树脂组合物未完全固化或树脂组合物软化; 和固化步骤/固化步骤，其中树脂组合物固化或固化。

公开(公告)号：US20110120754A1

公开(公告)日：2011-05-26

申请号：US12674803

申请日：2007-09-13

申请人： Masayoshi Kondo ,  Masaaki Kato ,  Toshiaki Chuma ,  Toshio Komiyatani ,  Takahisa Iida ,  Kenichi Kanemasa

发明人： Masayoshi Kondo ,  Masaaki Kato ,  Toshiaki Chuma ,  Toshio Komiyatani ,  Takahisa Iida ,  Kenichi Kanemasa

IPC分类号： H05K1/02

CPC分类号： H01L23/49833 ,  H01L23/14 ,  H01L23/3735 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/068 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A multilayer wiring board includes: a rigid portion including a first base member having flexibility and surfaces, the first base member having a first insulating layer and a first conductor layer, and a second base member bonded on at least one of the surfaces of the first base member and having rigidity higher than that of the first base member, the second base member having a second insulating layer and a second conductor layer; and a flexible portion provided so as to be continuously extended from the rigid portion, the flexible portion constituted from the first base member, wherein in the case where a coefficient of thermal expansion of the second insulating layer is measured by a thermal mechanical analysis based on JIS C 6481 at a predetermined temperature, the coefficient of thermal expansion of the second insulating layer in a plane direction thereof is 13 ppm/° C. or lower and the coefficient of thermal expansion of the second insulating layer in a thickness direction thereof is 20 ppm/° C. or lower.

摘要翻译： 多层布线板包括：刚性部分，其包括具有柔性和表面的第一基底构件，所述第一基底构件具有第一绝缘层和第一导体层，以及第二基底构件，其接合在所述第一和第二基底构件的至少一个表面上 所述第二基底构件具有比所述第一基底构件的刚性更高的刚性，所述第二基底构件具有第二绝缘层和第二导体层; 以及柔性部，其设置成从所述刚性部分连续延伸，所述柔性部分由所述第一基底构件构成，其中在通过基于以下的热机械分析来测量所述第二绝缘层的热膨胀系数的情况下 JIS C 6481在规定的温度下，第二绝缘层的面方向的热膨胀系数为13ppm /℃以下，第二绝缘层的厚度方向的热膨胀系数为20 ppm /℃以下。

公开(公告)号：US20090264028A1

公开(公告)日：2009-10-22

申请号：US12440986

申请日：2006-09-14

申请人： Toshiaki Chuma

发明人： Toshiaki Chuma

IPC分类号： H01R4/02 ,  H05K3/00

CPC分类号： H05K3/4617 ,  B23K1/0016 ,  B23K35/001 ,  B23K35/0238 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  C25D5/48 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/0269 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T29/49149 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12903

摘要： A joint structure of the present invention includes a conductive member containing copper as a major component thereof, an electrode member containing copper as a major component thereof, and a joint portion formed by fusion welding the conductive member and the electrode member with a brazing material containing tin as a major component thereof and containing substantially no copper, wherein the amount of copper atoms contained in the alloy in the central part of the joint portion is higher than that in the outer circumference part.

摘要翻译： 本发明的接合结构包括以铜为主要成分的导电构件，以铜为主要成分的电极构件和通过将导电构件和电极构件与含有 锡作为其主要组分并且基本上不含铜，其中在接合部分的中心部分中合金中包含的铜原子的量高于外周部分。

公开(公告)号：US07576288B2

公开(公告)日：2009-08-18

申请号：US10534962

申请日：2003-11-19

申请人： Masayoshi Kondo ,  Masaaki Kato ,  Toshiaki Chuma ,  Satoru Nakao ,  Kentaro Fujiura

发明人： Masayoshi Kondo ,  Masaaki Kato ,  Toshiaki Chuma ,  Satoru Nakao ,  Kentaro Fujiura

IPC分类号： H05K1/00

CPC分类号： H05K3/4635 ,  H05K1/0393 ,  H05K3/3489 ,  H05K3/386 ,  H05K3/4602 ,  H05K3/4617 ,  H05K3/4691 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2203/0733 ,  H05K2203/1189

摘要： A multilayer flexible wiring board including (1) plural single-sided wiring boards each having a wiring pattern on one side of the corresponding substrate and two-layer conductor posts projecting from the wiring pattern to the side of the substrate opposite from the wiring pattern, wherein the substrates other than that of the outermost layer have the pads to be connected to the two-layer conductor posts on the side opposite from the conductor posts, and the wiring pattern has no surface coating; (2) a flexible wiring board having on at least one side thereof the pads for connection to the conductor posts and including a wiring pattern with surface coating applied on the flexible portion but no surface coating applied on the multilayer portion, and (3) an adhesive layer having a flux function, wherein the conductor posts and pads are connected by a metal or an alloy, and the wiring patterns are electrically connected.

摘要翻译： 一种多层柔性布线基板，包括：（1）多个单面布线板，其各自具有在相应基板的一侧上的布线图案和从该布线图案向与该布线图案相对的一侧突出的两层导体柱， 其中除了最外层之外的衬底具有与导体柱相反的一侧连接到两层导体柱的焊盘，并且布线图案没有表面涂层; （2）柔性布线板，其至少一侧具有用于连接到导体柱的焊盘，并且包括施加在柔性部分上的表面涂层的布线图案，但是没有施加在多层部分上的表面涂层，以及（3） 具有助焊剂功能的粘合剂层，其中导体柱和焊盘通​​过金属或合金连接，并且布线图案电连接。