发明授权
US07576426B2 Wafer level package including a device wafer integrated with a passive component
有权
晶圆级封装，包括与无源元件集成的器件晶片
- 专利标题： Wafer level package including a device wafer integrated with a passive component
- 专利标题（中）： 晶圆级封装，包括与无源元件集成的器件晶片
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申请号： US11097646申请日： 2005-04-01
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公开(公告)号： US07576426B2公开(公告)日： 2009-08-18
- 发明人: Qing Gan , Robert W. Warren , Anthony J. Lobianco , Steve X. Liang
- 申请人： Qing Gan , Robert W. Warren , Anthony J. Lobianco , Steve X. Liang
- 申请人地址： US CA Irvine
- 专利权人： Skyworks Solutions, Inc.
- 当前专利权人： Skyworks Solutions, Inc.
- 当前专利权人地址： US CA Irvine
- 代理机构： Lando & Anastasi, LLP
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; H01L23/48
摘要：
According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.
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