发明授权
- 专利标题： Electrically connecting substrate with electrical device
- 专利标题（中）： 电气连接基板与电气设备
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申请号： US12234459申请日： 2008-09-19
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公开(公告)号： US07576439B2公开(公告)日： 2009-08-18
- 发明人: David M. Craig , Chien-Hua Chen
- 申请人： David M. Craig , Chien-Hua Chen
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L23/48 ; H01L29/40 ; H01L21/44 ; B23K31/02 ; B23K1/00 ; B23K1/06
摘要：
A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the wire and a bonding pad of the electrical device.
公开/授权文献
- US20090014850A1 Electrically Connecting Substrate With Electrical Device 公开/授权日：2009-01-15
信息查询
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