发明授权
- 专利标题: Method for fabricating light emitting diode element
- 专利标题(中): 制造发光二极管元件的方法
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申请号: US11963580申请日: 2007-12-21
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公开(公告)号: US07579202B2公开(公告)日: 2009-08-25
- 发明人: Wen-Chieh Hsu , Yu-Chuan Liu , Jenn-Hwa Fu , Shih-Hung Lee , Tai-Chun Wang
- 申请人: Wen-Chieh Hsu , Yu-Chuan Liu , Jenn-Hwa Fu , Shih-Hung Lee , Tai-Chun Wang
- 申请人地址: TW Nantou
- 专利权人: Tekcore Co., Ltd.
- 当前专利权人: Tekcore Co., Ltd.
- 当前专利权人地址: TW Nantou
- 代理机构: Muncy, Geissler, Olds & Lowe, PLLC
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
The present invention discloses a method for fabricating a light emitting diode element, which incorporates an epitaxial process with an etching process to etch LED epitaxial layers bottom up and form side-protrudent structures, whereby the LED epitaxial layers have non-rectangular inclines, which can solve the problem of total reflection and promote light-extraction efficiency. Further, the method of the present invention has a simple fabrication process, which can benefit mass production and lower cost.
公开/授权文献
- US20090162959A1 METHOD FOR FABRICATING LIGHT EMITTING DIODE ELEMENT 公开/授权日:2009-06-25
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