发明授权
- 专利标题: Methods for risk-informed chip layout generation
- 专利标题(中): 风险信息芯片布局生成方法
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申请号: US11680552申请日: 2007-02-28
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公开(公告)号: US07590968B1公开(公告)日: 2009-09-15
- 发明人: Scott T. Becker , Michael C. Smayling
- 申请人: Scott T. Becker , Michael C. Smayling
- 申请人地址: US CA Campbell
- 专利权人: Tela Innovations, Inc.
- 当前专利权人: Tela Innovations, Inc.
- 当前专利权人地址: US CA Campbell
- 代理机构: Martine Penilla & Gencarella, LLP
- 主分类号: G06F17/50
- IPC分类号: G06F17/50
摘要:
A chip layout is generated based on a quantified fabrication process capability. A minimum required value is selected for a fabrication process capability factor associated with a fabrication process to be performed on a layer sub-region within the chip. Design rules are determined for the layer sub-region within the chip that will enable the selected minimum required value for the fabrication process capability factor associated with the layer sub-region to be satisfied. A layout is then generated for the layer sub-region within the chip using the determined design rules associated with the layer sub-region. Fabrication process capability can be improved by restricting the design rules and generated layouts to a linear design style that requires features defined within the chip to be linear in shape and without bends. The linear design style enables optimization of photolithographic rendering without the need to consider two-dimensional optical effects.
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