Abstract:
A cell circuit and corresponding layout is disclosed to include linear-shaped diffusion fins defined to extend over a substrate in a first direction so as to extend parallel to each other. Each of the linear-shaped diffusion fins is defined to project upward from the substrate along their extent in the first direction. A number of gate level structures are defined to extend in a conformal manner over some of the number of linear-shaped diffusion fins. Portions of each gate level structure that extend over any of the linear-shaped diffusion fins extend in a second direction that is substantially perpendicular to the first direction. Portions of each gate level structure that extend over any of the linear-shaped diffusion fins form gate electrodes of a corresponding transistor. The diffusion fins and gate level structures can be placed in accordance with a diffusion fin virtual grate and a gate level virtual grate, respectively.
Abstract:
A semiconductor device includes first and second p-type diffusion regions, and first and second n-type diffusion regions that are each electrically connected to a common node. Each of a number of conductive features within a gate electrode level region is fabricated from a respective originating rectangular-shaped layout feature, with a centerline of each originating rectangular-shaped layout feature aligned in a parallel manner. The conductive features respectively form gate electrodes of first and second PMOS transistor devices, and first and second NMOS transistor devices. Widths of the first and second p-type diffusion regions are different, such that the first and second PMOS transistor devices have different widths. Widths of the first and second n-type diffusion regions are different, such that the first and second NMOS transistor devices have different widths. The first and second PMOS and first and second NMOS transistor devices form a cross-coupled transistor configuration.
Abstract:
A semiconductor device includes a cross-coupled transistor configuration formed by first and second PMOS transistors defined over first and second p-type diffusion regions, and by first and second NMOS transistors defined over first and second n-type diffusion regions, with each diffusion region electrically connected to a common node. Gate electrodes of the PMOS and NMOS transistors are formed by conductive features which extend in only a first parallel direction. At least a portion of each of the first and second p-type diffusion regions are formed over a first common line of extent that extends perpendicular to the first parallel direction. The first and second n-type diffusion regions are formed in a spaced apart manner relative to the first parallel direction, such that no single line of extent that extends across the substrate perpendicular to the first parallel direction intersects both the first and second n-type diffusion regions.
Abstract:
First and second PMOS transistors are defined over first and second p-type diffusion regions. First and second NMOS transistors are defined over first and second n-type diffusion regions. Each diffusion region is electrically connected to a common node. Gate electrodes are formed from conductive features that are each defined within any one gate level channel that is uniquely associated with and defined along one of a number of parallel gate electrode tracks. At least a portion of each of the first and second p-type diffusion regions are formed over a first common line of extent that extends perpendicular to the first parallel direction. The first and second n-type diffusion regions are formed in a spaced apart manner relative to the first parallel direction, such that no single line of extent that extends across the substrate perpendicular to the first parallel direction intersects both the first and second n-type diffusion regions.
Abstract:
First and second p-type diffusion regions, and first and second n-type diffusion regions are formed in a semiconductor device. Each diffusion region is electrically connected to a common node. Gate electrodes of cross-coupled transistors are defined to extend over the diffusion regions in only a first parallel direction, with each gate electrode fabricated from a respective originating rectangular-shaped layout feature. The first and second p-type diffusion regions are formed in a spaced apart manner relative to the first parallel direction, such that no single line of extent that extends across the substrate perpendicular to the first parallel direction intersects both the first and second p-type diffusion regions. At least a portion of the first n-type diffusion region and at least a portion of the second n-type diffusion region are formed over a common line of extent that extends across the substrate perpendicular to the first parallel direction.
Abstract:
A method is disclosed for defining a multiple patterned cell layout for use in an integrated circuit design. A layout is defined for a level of a cell in accordance with a dynamic array architecture so as to include a number of layout features. The number of layout features are linear-shaped and commonly oriented. The layout is split into a number of sub-layouts for the level of the cell. Each of the number of layout features in the layout is allocated to any one of the number of sub-layouts. Also, the layout is split such that each sub-layout is independently fabricatable. The sub-layouts for the level of the cell are stored on a computer readable medium.
Abstract:
An exclusive-or circuit includes a pass gate controlled by a second input node. The pass gate is connected to pass through a version of a logic state present at a first input node to an output node when so controlled. A transmission gate is controlled by the first input node. The transmission gate is connected to pass through a version of the logic state present at the second input node to the output node when so controlled. Pullup logic is controlled by both the first and second input nodes. The pullup logic is connected to drive the output node low when both the first and second input nodes are high. An exclusive-nor circuit is defined similar to the exclusive-or circuit, except that the pullup logic is replaced by pulldown logic which is connected to drive the output node high when both the first and second input nodes are high.
Abstract:
A semiconductor device includes conductive features that are each defined within any one gate level channel uniquely associated with and defined along one of a number of parallel gate electrode tracks. The conductive features form gate electrodes of first and second PMOS transistor devices, and first and second NMOS transistor devices. The gate electrodes of the first PMOS and first NMOS transistor devices extend along a first gate electrode track. The gate electrodes of the second PMOS and second NMOS transistor devices extend along second and third gate electrode tracks, respectively. A first set of interconnected conductors electrically connect the gate electrodes of the first PMOS and second NMOS transistor devices. A second set of interconnected conductors electrically connect the gate electrodes of the second PMOS and first NMOS transistor devices. The first and second sets of interconnected conductors traverse across each other within different levels of the semiconductor device.
Abstract:
A semiconductor chip is defined to include a logic block area having a first chip level in which layout features are placed according to a first virtual grate, and a second chip level in which layout features are placed according to a second virtual grate. A rational spatial relationship exists between the first and second virtual grates. A number of cells are placed within the logic block area. Each of the number of cells is defined according to an appropriate one of a number of cell phases. The appropriate one of the number of cell phases causes layout features in the first and second chip levels of a given placed cell to be aligned with the first and second virtual grates as positioned within the given placed cell.
Abstract:
A first linear-shaped conductive structure (LSCS) forming gate electrodes of both a first p-transistor and a first n-transistor. A second LSCS forming a gate electrode of a second p-transistor and including an extension portion extending away therefrom. A third LSCS forming a gate electrode of a second n-transistor and including an extension portion extending away therefrom. A fourth LSCS forming a gate electrode of a third p-transistor and including an extension portion extending away therefrom. A fifth LSCS forming a gate electrode of a third n-transistor and including an extension portion extending away therefrom. A sixth LSCS forming gate electrodes of both a fourth p-transistor and a fourth n-transistor. Four contact structures respectively contacting the extension portions of the second, third, fourth, and fifth LSCS's, such that at least two of the extension portions extend different distances beyond their contact structure.