发明授权
- 专利标题: Electronic-component alignment method
- 专利标题(中): 电子元器件对准方法
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申请号: US11420245申请日: 2006-05-25
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公开(公告)号: US07594319B2公开(公告)日: 2009-09-29
- 发明人: Atsushi Nakamura , Norio Kawatani , Masahisa Hosoi , Kazumasa Osoniwa , Hiroshi Tokunaga
- 申请人: Atsushi Nakamura , Norio Kawatani , Masahisa Hosoi , Kazumasa Osoniwa , Hiroshi Tokunaga
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Sonnenschein Nath & Rosenthal LLP
- 优先权: JP2002-285992 20020930; JP2002-290369 20021002
- 主分类号: H05K3/30
- IPC分类号: H05K3/30
摘要:
A first electronic component having two alignment holes perforated at predetermined positions thereof so as to be spaced away from each other by a predetermined interval is held with a receiving table, and also a second electronic component having two alignment marks formed at predetermined positions thereon so as to have an interval therebetween in agreement with that between the two alignment holes is held with a position-adjusting mechanism. In a state in which the alignment marks of the second electronic component are introduced in the corresponding alignment holes of the first electronic component, the mark-recognition apparatus captures the alignment marks and the alignment holes in the same fields of view thereof and measures the positions of the two components, and the position-adjusting mechanism adjusts the position of the second electronic component such that the alignment marks of the second electronic component lie at predetermined positions in the alignment holes of the first electronic component.
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