发明授权
- 专利标题： Polishing composition and polishing method using the same
- 专利标题（中）： 抛光组合物和抛光方法使用相同
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申请号： US11823606申请日： 2007-06-28
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公开(公告)号： US07597729B2公开(公告)日： 2009-10-06
- 发明人: Shinichiro Takami
- 申请人： Shinichiro Takami
- 申请人地址： JP Kiyosu-shi, Aichi
- 专利权人： Fujimi Incorporated
- 当前专利权人： Fujimi Incorporated
- 当前专利权人地址： JP Kiyosu-shi, Aichi
- 代理机构： Vidas, Arrett & Steinkraus, P.A.
- 优先权： JP2004-300873 20041015
- 主分类号： B24B1/00
- IPC分类号： B24B1/00 ; C09G1/02 ; C09G1/04 ; H01L21/302 ; H01L21/304
摘要：
A polishing composition contains an abrasive such as colloidal silica, at least one kind of compound selected from imidazole and an imidazole derivative, and water. The polishing composition preferably further contains an alkali compound, a water-soluble polymer, or a chelating agent. The polishing composition is suitable for use in polishing an edge of an object such as a semiconductor substrate.
公开/授权文献
- US20070256368A1 Polishing composition and polising method using the same 公开/授权日：2007-11-08
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