Invention Grant
- Patent Title: Light emitting diode structure and method for fabricating the same
- Patent Title (中): 发光二极管结构及其制造方法
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Application No.: US11963517Application Date: 2007-12-21
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Publication No.: US07598105B2Publication Date: 2009-10-06
- Inventor: Chia-Ming Lee , Hung-Cheng Lin , Jen-Inn Chyi
- Applicant: Chia-Ming Lee , Hung-Cheng Lin , Jen-Inn Chyi
- Applicant Address: TW Nantou
- Assignee: Tekcore Co., Ltd.
- Current Assignee: Tekcore Co., Ltd.
- Current Assignee Address: TW Nantou
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
The present invention discloses a light emitting diode structure and a method for fabricating the same. In the present invention, a substrate is placed in a solution to form a chemical reaction layer. Next, the substrate is etched to form a plurality of concave zones and a plurality of convex zones with the chemical reaction layer overhead. Next, the chemical reaction layer is removed to form an irregular geometry of the concave zones and convex zones on the surface of the substrate. Then, a semiconductor light emitting structure is epitaxially formed on the surface of the substrate. Thereby, the present invention can achieve a light emitting diode structure having improved internal and external quantum efficiencies.
Public/Granted literature
- US20090159871A1 LIGHT EMITTING DIODE STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2009-06-25
Information query
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