发明授权
- 专利标题: Environmentally robust passivation structures for high-voltage silicon carbide semiconductor devices
- 专利标题(中): 用于高压碳化硅半导体器件的环境坚固的钝化结构
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申请号: US11328550申请日: 2006-01-10
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公开(公告)号: US07598576B2公开(公告)日: 2009-10-06
- 发明人: Allan Ward, III , Jason Patrick Henning
- 申请人: Allan Ward, III , Jason Patrick Henning
- 申请人地址: US NC Durham
- 专利权人: Cree, Inc.
- 当前专利权人: Cree, Inc.
- 当前专利权人地址: US NC Durham
- 代理机构: Summa, Additon & Ashe, P.A.
- 主分类号: H01L29/15
- IPC分类号: H01L29/15 ; H01L31/0256
摘要:
An improved termination structure for high field semiconductor devices in silicon carbide is disclosed. The termination structure includes a silicon carbide-based device for high-field operation, an active region in the device, an edge termination passivation for the active region, in which the edge termination passivation includes, an oxide layer on at least some of the silicon carbide portions of the device for satisfying surface states and lowering interface density, a non-stoichiometric layer of silicon nitride on the oxide layer for avoiding the incorporation of hydrogen and for reducing parasitic capacitance and minimizing trapping, and, a stoichiometric layer of silicon nitride on the nonstoichiometric layer for encapsulating the nonstoichiometric layer and the oxide layer.
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