Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11438684Application Date: 2006-05-23
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Publication No.: US07601996B2Publication Date: 2009-10-13
- Inventor: Hiroyuki Ohta , Kenichi Okabe
- Applicant: Hiroyuki Ohta , Kenichi Okabe
- Applicant Address: JP Tokyo
- Assignee: Fujitsu Microelectronics Limited
- Current Assignee: Fujitsu Microelectronics Limited
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2006-007742 20060116
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A semiconductor device comprises a field-effect transistor arranged in a semiconductor substrate, which transistor has a gate electrode, source/drain impurity diffusion regions, and carbon layers surrounding the source/drain impurity diffusion regions. Each of the carbon layers is provided at an associated of the source/drain impurity diffusion regions and positioned so as to be offset from the front edge of a source/drain extension in direction away from the gate electrode and to surround as profile the associated source/drain impurity diffusion region.
Public/Granted literature
- US20070164375A1 Semiconductor device and manufacturing method thereof Public/Granted day:2007-07-19
Information query
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