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发明授权
US07602054B2 Method of forming a molded array package device having an exposed tab and structure 有权
形成具有暴露突片和结构的模制阵列封装装置的方法

Method of forming a molded array package device having an exposed tab and structure
摘要：
In one embodiment, a method for forming a molded flat pack style package includes attaching electronic chips to an array lead frame, which includes a plurality of elongated flag portions with tab portions and a plurality of leads. The method further includes connecting the electronic chips to specific leads, and then molding the array lead frame while leaving portions of the leads exposed to form a molded array structure. The molded array structure is then separated to provide molded flat pack style packages having exposed leads for insertion mount and exposed tab portions. In an alternative embodiment, the separation step produces a no-lead configuration with exposed tab portions.
摘要（中）：

在一个实施例中，一种用于形成模制扁平封装型封装的方法包括将电子芯片附接到阵列引线框架，该阵列引线框架包括具有突片部分和多个引线的多个细长标记部分。 该方法还包括将电子芯片连接到特定引线，然后模制阵列引线框架，同时使部分引线暴露以形成模制阵列结构。 然后将模制的阵列结构分离以提供具有用于插入安装和暴露的突片部分的暴露引线的模制扁平封装型封装。 在替代实施例中，分离步骤产生具有暴露的突片部分的无引线配置。

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