Invention Grant
- Patent Title: Micromachining with short-pulsed, solid-state UV laser
- Patent Title (中): 用短脉冲固态紫外激光微加工
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Application No.: US11440697Application Date: 2006-05-24
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Publication No.: US07605343B2Publication Date: 2009-10-20
- Inventor: Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , John Davignon
- Applicant: Weisheng Lei , Glenn Simenson , Hisashi Matsumoto , John Davignon
- Applicant Address: US OR Portland
- Assignee: Electro Scientific Industries, Inc.
- Current Assignee: Electro Scientific Industries, Inc.
- Current Assignee Address: US OR Portland
- Agency: Stoel Rives LLP
- Main IPC: B23K26/38
- IPC: B23K26/38
Abstract:
In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output.
Public/Granted literature
- US20070272667A1 Micromachining with short-pulsed, solid-state UV laser Public/Granted day:2007-11-29
Information query
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