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    Methods of drilling through-holes in homogenous and non-homogeneous substrates
    5.
    发明申请
    Methods of drilling through-holes in homogenous and non-homogeneous substrates 失效
    在同质和非均匀基质中钻孔的方法

    公开(公告)号：US20050230365A1

    公开(公告)日：2005-10-20

    申请号：US10825039

    申请日：2004-04-14

    Applicant: Weisheng Lei ,  John Davignon

    Inventor： Weisheng Lei ,  John Davignon

    IPC: B23K26/38 ,  B23K26/40 ,  H01L21/768 ,  H01L23/48 ,  H05K3/00

    CPC classification number: H05K3/0038 ,  B23K26/384 ,  B23K26/40 ,  B23K2103/36 ,  B23K2103/50 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0026 ,  H05K2203/108 ,  H05K2203/1476 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: A differential diameter hole drilling method by which through-holes having improved major surface quality are formed in a target material involves drilling a pilot hole having a diameter that is less than the desired diameter of the through-hole and then drilling a through-hole having the desired diameter. The pilot hole forms a channel from which thermal energy produced during laser drilling can diffuse into the environment, thereby reducing the amount of thermal energy diffusing into the surrounding target material matrix and the degree of thermal damage to the heat affected zone of the target material matrix. The pilot hole also forms a channel through which ablated target material may be removed, thereby increasing overall through-hole throughput. Pilot hole formation reduces the thermal energy required to form the remaining portion of the through-hole and thereby results in less thermal damage to the surrounding target material matrix.

    Abstract translation: 在目标材料中形成具有改善的主表面质量的通孔的差分直径钻孔方法包括钻出具有小于通孔所需直径的直径的导向孔，然后钻一个具有 所需的直径。 引导孔形成通道，激光钻孔期间产生的热能可以扩散到环境中，从而减少扩散到周围目标材料基体中的热能的量和对目标材料基体的热影响区的热损伤程度 。 引导孔还形成通道，通过该通道可以去除烧蚀的靶材料，从而增加整体通孔生产量。 先导孔形成减少了形成通孔的剩余部分所需的热能，从而导致对周围目标材料基体的较少的热损伤。

    Multiple laser wavelength and pulse width process drilling
    6.
    发明授权
    Multiple laser wavelength and pulse width process drilling 失效
    多激光波长和脉冲宽度工艺钻孔

    公开(公告)号：US08116341B2

    公开(公告)日：2012-02-14

    申请号：US11756507

    申请日：2007-05-31

    Applicant: Weisheng Lei ,  Yunlong Sun ,  Yasu Osako ,  John Davignon ,  Glenn Simenson ,  Hisashi Matsumoto

    Inventor： Weisheng Lei ,  Yunlong Sun ,  Yasu Osako ,  John Davignon ,  Glenn Simenson ,  Hisashi Matsumoto

    IPC: H01S3/109 ,  H01S3/10 ,  B23K26/38

    CPC classification number: H05K3/0038 ,  B23K26/389 ,  H01S3/0092 ,  H01S3/082 ,  H01S3/107 ,  H01S3/109 ,  H01S3/117 ,  H05K1/0366 ,  H05K3/0035 ,  H05K2203/108

    Abstract: Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to remove a portion of target material from a target material location of a workpiece and rapidly clean remnants of the target material bonded to a metal layer underlying the target material location at a material removal rate. A first embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and second wavelengths. A second embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and pulse widths.

    Abstract translation: 优选地衍生自单个激光束的双光束激光输出提高了在包括纤维增强树脂的目标材料（例如印刷电路板）中钻出的通孔的侧壁质量。 两个实施例各自使用两个激光输出部件来从工件的目标材料位置移除目标材料的一部分，并以材料去除速率快速地清洁与目标材料位置下方的金属层粘合的残留物。 第一实施例需要引导入射到目标材料位置处的目标材料的一部分，处理激光输出具有由相应的第一和第二波长表征的第一和第二分量。 第二实施例需要引导在目标材料位置处的目标材料的一部分上的入射，该处理激光输出具有由相应的第一和第二脉冲宽度表征的第一和第二分量。

    MULTIPLE LASER WAVELENGTH AND PULSE WIDTH PROCESS DRILLING
    7.
    发明申请
    MULTIPLE LASER WAVELENGTH AND PULSE WIDTH PROCESS DRILLING 失效
    多激光波长和脉冲宽度过程钻孔

    公开(公告)号：US20080296272A1

    公开(公告)日：2008-12-04

    申请号：US11756507

    申请日：2007-05-31

    Applicant: Weisheng Lei ,  Yunlong Sun ,  Yasu Osako ,  John Davignon ,  Glenn Simenson ,  Hisashi Matsumoto

    Inventor： Weisheng Lei ,  Yunlong Sun ,  Yasu Osako ,  John Davignon ,  Glenn Simenson ,  Hisashi Matsumoto

    IPC: B23K26/38

    CPC classification number: H05K3/0038 ,  B23K26/389 ,  H01S3/0092 ,  H01S3/082 ,  H01S3/107 ,  H01S3/109 ,  H01S3/117 ,  H05K1/0366 ,  H05K3/0035 ,  H05K2203/108

    Abstract: Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to remove a portion of target material from a target material location of a workpiece and rapidly clean remnants of the target material bonded to a metal layer underlying the target material location at a material removal rate. A first embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and second wavelengths. A second embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and pulse widths.

    Abstract translation: 优选地衍生自单个激光束的双光束激光输出提高了在包括纤维增强树脂的目标材料（例如印刷电路板）中钻出的通孔的侧壁质量。 两个实施例各自使用两个激光输出部件来从工件的目标材料位置移除目标材料的一部分，并以材料去除速率快速地清洁与目标材料位置下方的金属层粘合的残留物。 第一实施例需要引导入射到目标材料位置处的目标材料的一部分，处理激光输出具有由相应的第一和第二波长表征的第一和第二分量。 第二实施例需要引导在目标材料位置处的目标材料的一部分上的入射，该处理激光输出具有由相应的第一和第二脉冲宽度表征的第一和第二分量。

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