Invention Grant
- Patent Title: Stabilizing a substrate using a vacuum preload air bearing chuck
- Patent Title (中): 使用真空预压空气轴承卡盘稳定基板
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Application No.: US11688720Application Date: 2007-03-20
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Publication No.: US07607647B2Publication Date: 2009-10-27
- Inventor: Guoheng Zhao , Alexander Belyaev , Christian H. Wolters , Paul Andrew Doyle , Howard W. Dando , Mehdi Vaez-Iravani
- Applicant: Guoheng Zhao , Alexander Belyaev , Christian H. Wolters , Paul Andrew Doyle , Howard W. Dando , Mehdi Vaez-Iravani
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Technologies Corporation
- Current Assignee: KLA-Tencor Technologies Corporation
- Current Assignee Address: US CA Milpitas
- Agency: JDI Patent
- Agent Joshua D. Isenberg
- Main IPC: B25B11/00
- IPC: B25B11/00
Abstract:
Substrate processing method and apparatus are disclosed. The substrate processing apparatus includes a non-contact air bearing chuck with a vacuum preload.
Public/Granted literature
- US20080229811A1 STABILIZING A SUBSTRATE USING A VACUUM PRELOAD AIR BEARING CHUCK Public/Granted day:2008-09-25
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