Invention Grant
US07609805B2 Mask used for LIGA process, method of manufacturing the mask, and method of manufacturing microstructure using LIGA process
有权
用于LIGA工艺的掩模,制造掩模的方法以及使用LIGA工艺制造微结构的方法
- Patent Title: Mask used for LIGA process, method of manufacturing the mask, and method of manufacturing microstructure using LIGA process
- Patent Title (中): 用于LIGA工艺的掩模,制造掩模的方法以及使用LIGA工艺制造微结构的方法
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Application No.: US11896273Application Date: 2007-08-30
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Publication No.: US07609805B2Publication Date: 2009-10-27
- Inventor: Chan-wook Baik , Yong-wan Jin , Gun-sik Park , Jong-min Kim , Young-min Shin , Jin-kyu So
- Applicant: Chan-wook Baik , Yong-wan Jin , Gun-sik Park , Jong-min Kim , Young-min Shin , Jin-kyu So
- Applicant Address: KR Gyeonggi-do KR Seoul
- Assignee: Samsung Electronics Co., Ltd.,Seoul National University Industry Foundation
- Current Assignee: Samsung Electronics Co., Ltd.,Seoul National University Industry Foundation
- Current Assignee Address: KR Gyeonggi-do KR Seoul
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2007-0001159 20070104
- Main IPC: G21K5/00
- IPC: G21K5/00

Abstract:
A mask used for a Lithographie, Galvanofomung, and Abformung (LIGA) process, a method for manufacturing the mask, and a method for manufacturing a microstructure using a LIGA process. The method for manufacturing the microstructure using the LIGA process contemplates forming a substrate for the microstructure, a plurality of photosensitive layers, each photosensitive layer having a plating hole and an aligning pinhole, and an aligning pin capable of being inserted into the aligning pinhole, with the aligning pinholes of the photosensitive layers being formed in corresponding positions, and repeating a process of stacking the photosensitive layer on the substrate for the microstructure and a process of forming a plating layer by plating the plating hole of the stacked photosensitive layer with a metal for a number of times corresponding to the number of the photosensitive layers, and when the photosensitive layers are stacked on the substrate for the structure, the photosensitive layers being aligned with one another by inserting the aligning pin into the aligning pinholes of all the photosensitive layers stacked on the substrate for the microstructure to penetrate all the photosensitive layers.
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