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公开(公告)号：US08304743B2
公开(公告)日：2012-11-06
申请号：US12285671
申请日：2008-10-10
Applicant: Chan Wook Baik , Anurag Srivastava , Jong Min Kim , Sun Il Kim , Young Mok Son , Gun Sik Park , Jin Kyu So
Inventor： Chan Wook Baik , Anurag Srivastava , Jong Min Kim , Sun Il Kim , Young Mok Son , Gun Sik Park , Jin Kyu So
IPC: G21K5/04
Abstract: An electron beam focusing electrode and an electron gun using the same may include a plate having a polygonal through-hole; at least a projecting portion formed on at least one side of the through-hole. By using the electron beam focusing electrode, a spreading phenomenon of an electron beam having a rectangular cross section may be reduced. Further, the output of the electron gun may be increased, and electron beams may be easily focused.
Abstract translation: 电子束聚焦电极和使用该电子束的电子枪可以包括具有多边形通孔的板; 至少形成在所述通孔的至少一侧的突出部。 通过使用电子束聚焦电极，可以减小具有矩形横截面的电子束的扩展现象。 此外，电子枪的输出可能增加，并且电子束可能容易聚焦。
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公开(公告)号：US20090289542A1
公开(公告)日：2009-11-26
申请号：US12285671
申请日：2008-10-10
Applicant: Chan Wook Baik , Anurag Srivastava , Jong Min Kim , Sun Il Kim , Young Mok Son , Gun Sik Park , Jin Kyu So
Inventor： Chan Wook Baik , Anurag Srivastava , Jong Min Kim , Sun Il Kim , Young Mok Son , Gun Sik Park , Jin Kyu So
Abstract: An electron beam focusing electrode and an electron gun using the same may include a plate having a polygonal through-hole; at least a projecting portion formed on at least one side of the through-hole. By using the electron beam focusing electrode, a spreading phenomenon of an electron beam having a rectangular cross section may be reduced. Further, the output of the electron gun may be increased, and electron beams may be easily focused.
Abstract translation: 电子束聚焦电极和使用该电子束的电子枪可以包括具有多边形通孔的板; 至少形成在所述通孔的至少一侧的突出部。 通过使用电子束聚焦电极，可以减小具有矩形横截面的电子束的扩展现象。 此外，电子枪的输出可能增加，并且电子束可能容易聚焦。
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3.发明申请Mask used for LIGA process, method of manufacturing the mask, and method of manufacturing microstructure using LIGA process 有权用于LIGA工艺的掩模，制造掩模的方法以及使用LIGA工艺制造微结构的方法公开(公告)号：US20080166640A1
公开(公告)日：2008-07-10
申请号：US11896273
申请日：2007-08-30
Applicant: Chan-wook Baik , Yong-wan Jin , Gun-sik Park , Jong-min Kim , Young-min Shin , Jin-kyu So
Inventor： Chan-wook Baik , Yong-wan Jin , Gun-sik Park , Jong-min Kim , Young-min Shin , Jin-kyu So
CPC classification number: G03F7/00 , G03F1/22 , G03F9/7053 , G03F9/7076
Abstract: A mask used for a Lithographie, Galvanofomung, and Abformung (LIGA) process, a method for manufacturing the mask, and a method for manufacturing a microstructure using a LIGA process. The method for manufacturing the microstructure using the LIGA process contemplates forming a substrate for the microstructure, a plurality of photosensitive layers, each photosensitive layer having a plating hole and an aligning pinhole, and an aligning pin capable of being inserted into the aligning pinhole, with the aligning pinholes of the photosensitive layers being formed in corresponding positions, and repeating a process of stacking the photosensitive layer on the substrate for the microstructure and a process of forming a plating layer by plating the plating hole of the stacked photosensitive layer with a metal for a number of times corresponding to the number of the photosensitive layers, and when the photosensitive layers are stacked on the substrate for the structure, the photosensitive layers being aligned with one another by inserting the aligning pin into the aligning pinholes of all the photosensitive layers stacked on the substrate for the microstructure to penetrate all the photosensitive layers.
Abstract translation: 用于石版印刷，Galvanofomung和Abformung（LIGA）工艺的掩模，用于制造掩模的方法以及使用LIGA工艺制造微结构的方法。 使用LIGA方法制造微结构的方法考虑形成用于微结构的基底，多个感光层，每个感光层具有电镀孔和对准针孔，以及能够插入到对准针孔中的对准销， 感光层的对准针孔形成在相应的位置上，并且重复将用于微结构的基板上的感光层层叠的工艺和通过用金属镀覆层叠的感光层的电镀孔来形成镀层的工艺 对应于感光层的数量的次数，并且当感光层堆叠在用于结构的基板上时，感光层通过将对准销插入到所有感光层的对准针孔中而彼此对准 在基板上用于微结构穿透 将感光层。
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4.发明授权Mask used for LIGA process, method of manufacturing the mask, and method of manufacturing microstructure using LIGA process 有权用于LIGA工艺的掩模，制造掩模的方法以及使用LIGA工艺制造微结构的方法公开(公告)号：US07609805B2
公开(公告)日：2009-10-27
申请号：US11896273
申请日：2007-08-30
Applicant: Chan-wook Baik , Yong-wan Jin , Gun-sik Park , Jong-min Kim , Young-min Shin , Jin-kyu So
Inventor： Chan-wook Baik , Yong-wan Jin , Gun-sik Park , Jong-min Kim , Young-min Shin , Jin-kyu So
IPC: G21K5/00
CPC classification number: G03F7/00 , G03F1/22 , G03F9/7053 , G03F9/7076
Abstract: A mask used for a Lithographie, Galvanofomung, and Abformung (LIGA) process, a method for manufacturing the mask, and a method for manufacturing a microstructure using a LIGA process. The method for manufacturing the microstructure using the LIGA process contemplates forming a substrate for the microstructure, a plurality of photosensitive layers, each photosensitive layer having a plating hole and an aligning pinhole, and an aligning pin capable of being inserted into the aligning pinhole, with the aligning pinholes of the photosensitive layers being formed in corresponding positions, and repeating a process of stacking the photosensitive layer on the substrate for the microstructure and a process of forming a plating layer by plating the plating hole of the stacked photosensitive layer with a metal for a number of times corresponding to the number of the photosensitive layers, and when the photosensitive layers are stacked on the substrate for the structure, the photosensitive layers being aligned with one another by inserting the aligning pin into the aligning pinholes of all the photosensitive layers stacked on the substrate for the microstructure to penetrate all the photosensitive layers.
Abstract translation: 用于石版印刷，Galvanofomung和Abformung（LIGA）工艺的掩模，用于制造掩模的方法以及使用LIGA工艺制造微结构的方法。 使用LIGA方法制造微结构的方法考虑形成用于微结构的基底，多个感光层，每个感光层具有电镀孔和对准针孔，以及能够插入到对准针孔中的对准销， 感光层的对准针孔形成在相应的位置上，并且重复将用于微结构的基板上的感光层层叠的工艺和通过用金属镀覆层叠的感光层的电镀孔来形成镀层的工艺 对应于感光层的数量的次数，并且当感光层堆叠在用于结构的基板上时，感光层通过将对准销插入到所有感光层的对准针孔中而彼此对准 在基板上用于微结构穿透 感光层。
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