发明授权
- 专利标题： Head gimbal assembly provided with solder ball connecting structure allowing re-utilization of suspension
- 专利标题（中）： 头万向节组件提供焊球连接结构，允许重新利用悬架
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申请号： US11317343申请日： 2005-12-22
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公开(公告)号： US07619856B2公开(公告)日： 2009-11-17
- 发明人: Yuhsuke Matsumoto , Tatsushi Yoshida , Noriyuki Saiki , Yukihiro Isono , Hideo Yamakura
- 申请人： Yuhsuke Matsumoto , Tatsushi Yoshida , Noriyuki Saiki , Yukihiro Isono , Hideo Yamakura
- 申请人地址： NL Amsterdam
- 专利权人： Hitachi Global Storage Technologies Netherlands B.V.
- 当前专利权人： Hitachi Global Storage Technologies Netherlands B.V.
- 当前专利权人地址： NL Amsterdam
- 代理机构： Townsend and Townsend and Crew LLP
- 代理商 John Henkhaus
- 优先权： JP2004-376310 20041227
- 主分类号： G11B5/60
- IPC分类号： G11B5/60
摘要：
Embodiments of the invention provide a head gimbal assembly (HGA) provided with a solder ball connecting structure suitable for the re-utilization of a suspension assembly. In one embodiment, the HGA includes lead wires provided at front ends thereof with lead pads and also includes slider pads capable of being connected to the lead pads by solder ball bonding with the use of solder balls. Respective grooves formed in the surfaces of the slider pads inhibit the solder balls from rotating and moving over the surfaces of the slider pads and the lead pads before the radiation of a laser beam.
公开/授权文献
- US20060139809A1 Head gimbal assembly and magnetic disk drive 公开/授权日：2006-06-29
信息查询
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