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公开(公告)号：US20060139809A1
公开(公告)日：2006-06-29
申请号：US11317343
申请日：2005-12-22
IPC分类号： G11B5/60
CPC分类号： G11B5/4826 , G11B5/4853 , H01L2224/742 , H05K1/111 , H05K3/3442 , H05K2201/09745 , H05K2201/10727 , H05K2203/041 , Y02P70/613 , Y10T29/4903
摘要： Embodiments of the invention provide a head gimbal assembly (HGA) provided with a solder ball connecting structure suitable for the re-utilization of a suspension assembly. In one embodiment, the HGA includes lead wires provided at front ends thereof with lead pads and also includes slider pads capable of being connected to the lead pads by solder ball bonding with the use of solder balls. Respective grooves formed in the surfaces of the slider pads inhibit the solder balls from rotating and moving over the surfaces of the slider pads and the lead pads before the radiation of a laser beam.
摘要翻译： 本发明的实施例提供了具有适于重新利用悬架组件的焊球连接结构的头万向节组件（HGA）。 在一个实施例中，HGA包括在其前端处设置有引线焊盘的引线，并且还包括能够通过使用焊球通过焊球接合而连接到引线焊盘的滑块。 在激光束的辐射之前，形成在滑动垫的表面中的各个凹槽阻止焊球旋转并在滑块和引线板的表面上移动。
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2.发明授权Head gimbal assembly provided with solder ball connecting structure allowing re-utilization of suspension 有权头万向节组件提供焊球连接结构，允许重新利用悬架公开(公告)号：US07619856B2
公开(公告)日：2009-11-17
申请号：US11317343
申请日：2005-12-22
IPC分类号： G11B5/60
CPC分类号： G11B5/4826 , G11B5/4853 , H01L2224/742 , H05K1/111 , H05K3/3442 , H05K2201/09745 , H05K2201/10727 , H05K2203/041 , Y02P70/613 , Y10T29/4903
摘要： Embodiments of the invention provide a head gimbal assembly (HGA) provided with a solder ball connecting structure suitable for the re-utilization of a suspension assembly. In one embodiment, the HGA includes lead wires provided at front ends thereof with lead pads and also includes slider pads capable of being connected to the lead pads by solder ball bonding with the use of solder balls. Respective grooves formed in the surfaces of the slider pads inhibit the solder balls from rotating and moving over the surfaces of the slider pads and the lead pads before the radiation of a laser beam.
摘要翻译： 本发明的实施例提供了具有适于重新利用悬架组件的焊球连接结构的头万向节组件（HGA）。 在一个实施例中，HGA包括在其前端处设置有引线焊盘的引线，并且还包括能够通过使用焊球通过焊球接合而连接到引线焊盘的滑块。 在激光束的辐射之前，形成在滑动垫的表面中的各个凹槽阻止焊球旋转并在滑块和引线板的表面上移动。
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公开(公告)号：US20110132879A1
公开(公告)日：2011-06-09
申请号：US12961989
申请日：2010-12-07
IPC分类号： B23K9/04
CPC分类号： B23K1/0016 , B23K1/0056 , B23K3/0623
摘要： A method for connecting electrical parts The method includes retaining a piece of metal within a nozzle, supplying inert gas to the nozzle, and irradiating the retained piece of metal with a light source while the supplied inert gas flows from apertures in the nozzle. The metal is melted by the light source. The method also includes ejecting the melted metal from the nozzle by the supplied inert gas onto electrical parts.
摘要翻译： 一种用于连接电气部件的方法该方法包括将一块金属保持在喷嘴内，向喷嘴供给惰性气体，并且在所供应的惰性气体从喷嘴中的孔流动的同时用光源照射保留的金属片。 金属被光源熔化。 该方法还包括通过所提供的惰性气体将熔融的金属从喷嘴喷射到电气部件上。
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4.发明授权公开(公告)号：US07583475B2
公开(公告)日：2009-09-01
申请号：US11066949
申请日：2005-02-25
申请人： Yuhsuke Matsumoto , Tatsumi Tsuchiya , Takaaki Murokawa , Yoshio Uematsu , Tatsushi Yoshida , Nobuyuki Hashi , Hiroyasu Tsuchida , Takuma Muraki
发明人： Yuhsuke Matsumoto , Tatsumi Tsuchiya , Takaaki Murokawa , Yoshio Uematsu , Tatsushi Yoshida , Nobuyuki Hashi , Hiroyasu Tsuchida , Takuma Muraki
IPC分类号： G11B5/48
CPC分类号： H05K3/3442 , G11B5/4853 , H05K1/111 , H05K2201/0397 , H05K2201/09663 , H05K2201/0969 , H05K2201/09745 , H05K2201/10727 , H05K2203/041 , Y02P70/611 , Y02P70/613
摘要： Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.
摘要翻译： 本发明的实施例提供了当使用焊球连接接合焊盘和引线接线焊盘时防止焊料球偏离中心线并发生焊接问题的技术。 在一个实施例中，头悬挂组件包括设置在为弯曲提供的引线布线垫和为滑块设置的接合焊盘之间的焊球。 然后将焊球熔化以在引线接线焊盘和焊盘之间形成焊接接头。 在引线配线衬垫的前表面上的中心线附近的位置处设有通槽。 焊球通过重力从引线接线板的前表面落入通槽。 因此，与滑块接触的接触区域被固定在滑块的一侧。
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5.发明申请公开(公告)号：US20060012918A1
公开(公告)日：2006-01-19
申请号：US11179219
申请日：2005-07-11
IPC分类号： G11B5/60
CPC分类号： B23H7/02 , B23K1/018 , H05K3/3442 , H05K2201/10727 , H05K2203/0195 , H05K2203/176 , Y02P70/613
摘要： A method for removing a lead-free solder from a slider pad is provided to permit re-utilization of a head/slider used in a magnetic disk drive. In one embodiment, a slider pad formed on a head/slider and a lead pad are connected to each other through a lead-free solder fillet. A cutting tool is heated beforehand to a temperature near the melting point of the lead-free solder. The cutting tool is moved in parallel with a surface of the slider pad to cut the solder fillet while softening the solder fillet. The solder fillet is removed so as not to impose a stress on the slider pad and in a state in which the head/slider can be re-utilized.
摘要翻译： 提供了一种用于从滑动板移除无铅焊料的方法，以允许对磁盘驱动器中使用的磁头/滑块的再利用。 在一个实施例中，形成在头部/滑块和引线焊盘上的滑动焊盘通过无铅焊接圆角彼此连接。 预先将切削工具加热至接近无铅焊料的熔点的温度。 切削工具与滑块的表面平行地移动，以在软化焊料圆角的同时切割焊锡圆角。 去除焊接圆角，以便不在滑块上施加应力，并且在头/滑块可以被重新利用的状态下。
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6.发明申请公开(公告)号：US20050199680A1
公开(公告)日：2005-09-15
申请号：US11066949
申请日：2005-02-25
申请人： Yuhsuke Matsumoto , Tatsumi Tsuchiya , Takaaki Murokawa , Yoshio Uematsu , Tatsushi Yoshida , Nobuyuki Hashi , Hiroyasu Tsuchida , Takuma Muraki
发明人： Yuhsuke Matsumoto , Tatsumi Tsuchiya , Takaaki Murokawa , Yoshio Uematsu , Tatsushi Yoshida , Nobuyuki Hashi , Hiroyasu Tsuchida , Takuma Muraki
CPC分类号： H05K3/3442 , G11B5/4853 , H05K1/111 , H05K2201/0397 , H05K2201/09663 , H05K2201/0969 , H05K2201/09745 , H05K2201/10727 , H05K2203/041 , Y02P70/611 , Y02P70/613
摘要： Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.
摘要翻译： 本发明的实施例提供了当使用焊球连接接合焊盘和引线接线焊盘时防止焊料球偏离中心线并发生焊接问题的技术。 在一个实施例中，头悬挂组件包括设置在为弯曲提供的引线布线垫和为滑块设置的接合焊盘之间的焊球。 然后将焊球熔化以在引线接线焊盘和焊盘之间形成焊接接头。 在引线配线衬垫的前表面上的中心线附近的位置处设有通槽。 焊球通过重力从引线接线板的前表面落入通槽。 因此，与滑块接触的接触区域被固定在滑块的一侧。
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7.发明授权Head-gimbal assembly with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge 有权具有悬挂铅焊盘的头部万向节组件具有禁止形成垫间焊接桥的形式公开(公告)号：US08477457B2
公开(公告)日：2013-07-02
申请号：US13229631
申请日：2011-09-09
CPC分类号： G11B5/4826
摘要： A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided.
摘要翻译： 一种具有悬挂铅焊盘的头部万向节组件（HGA），其具有禁止形成垫间焊接桥的形式。 HGA包括万向节，头滑块和多个悬挂引线板。 头滑块与万向节连接，并且包括多个头滑块垫。 多个悬挂引线板通过多个焊接接合与多个头部 - 滑动器垫片连接。 悬挂引线垫包括设置在相应的头部 - 滑动器垫附近的第一侧面，第二侧面，近侧，以及远侧。 靠近近侧的悬挂引线焊盘的第一宽度比从第一宽度近的侧面的悬挂引线焊盘的第二宽度大得多。 还提供了包括HGA的磁盘驱动器和具有与悬挂引线板相似形式的磁头滑块的磁头滑块。
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8.发明授权公开(公告)号：US07342749B2
公开(公告)日：2008-03-11
申请号：US11179219
申请日：2005-07-11
IPC分类号： G11B5/48
CPC分类号： B23H7/02 , B23K1/018 , H05K3/3442 , H05K2201/10727 , H05K2203/0195 , H05K2203/176 , Y02P70/613
摘要： A method for removing a lead-free solder from a slider pad is provided to permit re-utilization of a head/slider used in a magnetic disk drive. In one embodiment, a slider pad formed on a head/slider and a lead pad are connected to each other through a lead-free solder fillet. A cutting tool is heated beforehand to a temperature near the melting point of the lead-free solder. The cutting tool is moved in parallel with a surface of the slider pad to cut the solder fillet while softening the solder fillet. The solder fillet is removed so as not to impose a stress on the slider pad and in a state in which the head/slider can be re-utilized.
摘要翻译： 提供了一种用于从滑动板移除无铅焊料的方法，以允许对磁盘驱动器中使用的磁头/滑块的再利用。 在一个实施例中，形成在头部/滑块和引线焊盘上的滑动焊盘通过无铅焊接圆角彼此连接。 预先将切削工具加热至接近无铅焊料的熔点的温度。 切削工具与滑块的表面平行地移动，以在软化焊料圆角的同时切割焊锡圆角。 去除焊接圆角，以便不在滑块上施加应力，并且在头/滑块可以被重新利用的状态下。
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9.发明申请公开(公告)号：US20060238921A1
公开(公告)日：2006-10-26
申请号：US11112719
申请日：2005-04-21
申请人： Yuhsuke Matsumoto , Tatsushi Yoshida , Takaaki Murokawa , Tatsumi Tsuchiya , Yoshio Uematsu , Nobuyuki Hashi
发明人： Yuhsuke Matsumoto , Tatsushi Yoshida , Takaaki Murokawa , Tatsumi Tsuchiya , Yoshio Uematsu , Nobuyuki Hashi
CPC分类号： G11B5/4826 , H01L2224/742 , H01L2924/01322 , H05K3/3442 , H05K2201/0397 , H05K2201/10727 , H05K2203/041 , H05K2203/0465 , Y02P70/613
摘要： Embodiments of the invention provide a head gimbal assembly (HGA) capable of effecting solder ball connection with use of low energy. In one embodiment, the HGA includes a head/slider. In the head/slider, slider pads and lead wire pads are connected to each other by reflow of solder balls under the radiation of a laser beam. Lead layers are connected to a magnetic head and electrode studs are connected to the lead layers, respectively, and are also connected to the slider pads. The diameter R (m) of a solder ball and a sectional area S (m2) of an electrode stud are in a relation of R2≧4S.
摘要翻译： 本发明的实施例提供一种能够使用低能量实现焊球连接的头万向架组件（HGA）。 在一个实施例中，HGA包括头/滑块。 在头/滑块中，通过在激光束的辐射下回流焊球，滑块和引线焊盘彼此连接。 引线层连接到磁头，电极柱分别连接到引线层，并且还连接到滑块。 焊球的直径R（m）和电极柱的截面积S（m 2）之间的关系为R 2 2 / S 2 = 4S。
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10.发明申请HEAD-GIMBAL ASSEMBLY WITH A SUSPENSION-LEAD PAD HAVING A FORM THAT IS CONFIGURED TO INHIBIT FORMATION OF AN INTER-PAD SOLDER BRIDGE 有权具有悬挂铅柱的头部组件具有被配置为禁止形成内部焊接桥的形式公开(公告)号：US20130063839A1
公开(公告)日：2013-03-14
申请号：US13229631
申请日：2011-09-09
CPC分类号： G11B5/4826
摘要： A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided.
摘要翻译： 一种具有悬挂铅焊盘的头部万向节组件（HGA），其具有禁止形成垫间焊接桥的形式。 HGA包括万向节，头滑块和多个悬挂引线板。 头滑块与万向节连接，并且包括多个头滑块垫。 多个悬挂引线板通过多个焊接接合与多个头部 - 滑动器垫片连接。 悬挂引线垫包括设置在相应的头部 - 滑动器垫附近的第一侧面，第二侧面，近侧，以及远侧。 靠近近侧的悬挂引线焊盘的第一宽度比从第一宽度近的侧面的悬挂引线焊盘的第二宽度大得多。 还提供了包括HGA的磁盘驱动器和具有与悬挂引线板相似形式的磁头滑块的磁头滑块。
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