发明授权
US07625603B2 Crack and residue free conformal deposited silicon oxide with predictable and uniform etching characteristics 有权
裂纹和无残留的保形沉积氧化硅具有可预测和均匀的蚀刻特性

Crack and residue free conformal deposited silicon oxide with predictable and uniform etching characteristics
摘要:
A silicon oxide layer is formed by oxidation or decomposition of a silicon precursor gas in an oxygen-rich environment followed by annealing. The silicon oxide layer may be formed with slightly compressive stress to yield, following annealing, an oxide layer having very low stress. The silicon oxide layer thus formed is readily etched without resulting residue using HF-vapor.
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