Invention Grant
- Patent Title: Support with recessed electrically conductive chip attachment material for flip-chip bonding a light emitting chip
- Patent Title (中): 支持嵌入式导电芯片附件材料,用于倒装芯片接合发光芯片
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Application No.: US11520905Application Date: 2006-09-14
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Publication No.: US07635869B2Publication Date: 2009-12-22
- Inventor: Boris Kolodin , Michael Hsing , Stanton Earl Weaver, Jr. , Ivan Eliashevich , Srinath K. Aanegola
- Applicant: Boris Kolodin , Michael Hsing , Stanton Earl Weaver, Jr. , Ivan Eliashevich , Srinath K. Aanegola
- Applicant Address: US OH Valley View
- Assignee: Lumination LLC
- Current Assignee: Lumination LLC
- Current Assignee Address: US OH Valley View
- Agency: Fay Sharpe LLP
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
In a light emitting device, a light emitting chip (12, 112) includes a stack of semiconductor layers (14) and an electrode (24, 141, 142) disposed on the stack of semiconductor layers. A support (10, 10′, 110, 210) has a generally planar surface (30) supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material (40, 41, 141, 142) is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (36, 36′) of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.
Public/Granted literature
- US20080067537A1 Support for flip-chip bonding a light emitting chip Public/Granted day:2008-03-20
Information query
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