Invention Grant
- Patent Title: CMOS integrated circuit devices and substrates having buried silicon germanium layers therein and method of forming same
- Patent Title (中): 具有埋入硅锗层的CMOS集成电路器件和衬底及其形成方法
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Application No.: US11656717Application Date: 2007-01-23
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Publication No.: US07642140B2Publication Date: 2010-01-05
- Inventor: Geum-jong Bae , Tae-hee Choe , Sang-su Kim , Hwa-sung Rhee , Nae-in Lee , Kyung-wook Lee
- Applicant: Geum-jong Bae , Tae-hee Choe , Sang-su Kim , Hwa-sung Rhee , Nae-in Lee , Kyung-wook Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR00-670 20000107
- Main IPC: H01L21/84
- IPC: H01L21/84

Abstract:
CMOS integrated circuit devices include an electrically insulating layer and an unstrained silicon active layer on the electrically insulating layer. An insulated gate electrode is also provided on a surface of the unstrained silicon active layer. A Si1-xGex layer is also disposed between the electrically insulating layer and the unstrained silicon active layer. The Si1-xGex layer forms a first junction with the unstrained silicon active layer and has a graded concentration of Ge therein that decreases monotonically in a first direction extending from a peak level towards the surface of the unstrained silicon active layer. The peak Ge concentration level is greater than x=0.15 and the concentration of Ge in the Si1-xGex layer varies from the peak level to a level less than about x=0.1 at the first junction. The concentration of Ge at the first junction may be abrupt. More preferably, the concentration of Ge in the Si1-xGex layer varies from the peak level where 0.2
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