发明授权
- 专利标题: Polishing apparatus, polishing head and polishing method
- 专利标题(中): 抛光装置,抛光头和抛光方法
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申请号: US12371320申请日: 2009-02-13
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公开(公告)号: US07654883B2公开(公告)日: 2010-02-02
- 发明人: Masamitsu Kitahashi , Toshiyuki Kamei , Hidetoshi Takeda , Hiroyuki Tokunaga , Tamoaki Tajiri
- 申请人: Masamitsu Kitahashi , Toshiyuki Kamei , Hidetoshi Takeda , Hiroyuki Tokunaga , Tamoaki Tajiri
- 申请人地址: JP Nagasaki
- 专利权人: Sumco Techxiv Corporation
- 当前专利权人: Sumco Techxiv Corporation
- 当前专利权人地址: JP Nagasaki
- 代理机构: Husch Blackwell Sanders LLP Welsh & Katz
- 优先权: JP2002-282549 20020927
- 主分类号: B24B1/00
- IPC分类号: B24B1/00
摘要:
A polishing apparatus comprises a polishing plate (24), an abrasive cloth (25) attached to the surface of the polishing plate (24), a chuck (19) for holding and pressing one surface of a wafer (39) against the abrasive cloth (25), and a circular retaining ring (23) concentrically arranged on the periphery of the chuck (19). The retaining ring (23) is rotatable and vertically movable with respect to the chuck (19), and is pressed against the abrasive cloth (25) during the lapping step. The retaining ring (23) is lifted upward during the final polishing step, thereby preventing lapping grains from being brought into the final polishing stage. Accordingly, lapping and final polishing can be successively conducted using the same polishing head. With this structure, cost cutting of the apparatus can be realized, since lapping and final polishing are successively conducted using the same polishing head without bringing the lapping grains used for lapping into the final polishing stage.
公开/授权文献
- US20090156101A1 POLISHING APPARATUS, POLISHING HEAD AND POLISHING METHOD 公开/授权日:2009-06-18