公开(公告)号：US07654883B2

公开(公告)日：2010-02-02

申请号：US12371320

申请日：2009-02-13

申请人： Masamitsu Kitahashi ,  Toshiyuki Kamei ,  Hidetoshi Takeda ,  Hiroyuki Tokunaga ,  Tamoaki Tajiri

发明人： Masamitsu Kitahashi ,  Toshiyuki Kamei ,  Hidetoshi Takeda ,  Hiroyuki Tokunaga ,  Tamoaki Tajiri

IPC分类号： B24B1/00

CPC分类号： B24B37/30

摘要： A polishing apparatus comprises a polishing plate (24), an abrasive cloth (25) attached to the surface of the polishing plate (24), a chuck (19) for holding and pressing one surface of a wafer (39) against the abrasive cloth (25), and a circular retaining ring (23) concentrically arranged on the periphery of the chuck (19). The retaining ring (23) is rotatable and vertically movable with respect to the chuck (19), and is pressed against the abrasive cloth (25) during the lapping step. The retaining ring (23) is lifted upward during the final polishing step, thereby preventing lapping grains from being brought into the final polishing stage. Accordingly, lapping and final polishing can be successively conducted using the same polishing head. With this structure, cost cutting of the apparatus can be realized, since lapping and final polishing are successively conducted using the same polishing head without bringing the lapping grains used for lapping into the final polishing stage.

摘要翻译： 抛光装置包括抛光板（24），附着在抛光板（24）的表面上的研磨布（25），用于将晶片（39）的一个表面保持并压靠在研磨布上的卡盘（19） （25）和同心地布置在卡盘（19）的周边上的圆形保持环（23）。 保持环（23）可相对于卡盘（19）旋转并且可垂直移动，并且在研磨步骤期间被压靠在研磨布（25）上。 在最后的抛光步骤期间，保持环（23）被向上提升，从而防止研磨颗粒进入最终抛光阶段。 因此，可以使用相同的抛光头连续进行研磨和最终抛光。 利用这种结构，可以实现装置的成本削减，因为使用相同的抛光头连续进行研磨和最终抛光，而不将用于研磨的研磨颗粒带入最后的抛光阶段。

公开(公告)号：US07507148B2

公开(公告)日：2009-03-24

申请号：US10528287

申请日：2003-09-26

申请人： Masamitsu Kitahashi ,  Toshiyuki Kamei ,  Hidetoshi Takeda ,  Hiroyuki Tokunaga ,  Tamoaki Tajiri

发明人： Masamitsu Kitahashi ,  Toshiyuki Kamei ,  Hidetoshi Takeda ,  Hiroyuki Tokunaga ,  Tamoaki Tajiri

IPC分类号： B24B5/00

CPC分类号： B24B37/30

摘要： A polishing apparatus comprises a polishing plate (24), an abrasive cloth (25) attached to the surface of the polishing plate (24), a chuck (19) for holding and pressing one surface of a wafer (39) against the abrasive cloth (25), and a circular retaining ring (23) concentrically arranged on the periphery of the chuck (19). The retaining ring (23) is rotatable and vertically movable with respect to the chuck (19), and is pressed against the abrasive cloth (25) during the lapping step. The retaining ring (23) is lifted upward during the final polishing step, thereby preventing lapping grains from being brought into the final polishing stage. Accordingly, lapping and final polishing can be successively conducted using the same polishing head. With this structure, cost cutting of the apparatus can be realized, since lapping and final polishing are successively conducted using the same polishing head without bringing the lapping grains used for lapping into the final polishing stage.

摘要翻译： 抛光装置包括抛光板（24），附着在抛光板（24）的表面上的研磨布（25），用于将晶片（39）的一个表面保持并压靠在研磨布上的卡盘（19） （25）和同心地布置在卡盘（19）的周边上的圆形保持环（23）。 保持环（23）可相对于卡盘（19）旋转并且可垂直移动，并且在研磨步骤期间被压靠在研磨布（25）上。 在最后的抛光步骤期间，保持环（23）被向上提升，从而防止研磨颗粒进入最终抛光阶段。 因此，可以使用相同的抛光头连续进行研磨和最终抛光。 利用这种结构，可以实现装置的成本削减，因为使用相同的抛光头连续进行研磨和最终抛光，而不将用于研磨的研磨颗粒带入最后的抛光阶段。