发明授权
- 专利标题： High reliability multilayer circuit substrates and methods for their formation
- 专利标题（中）： 高可靠性多层电路基板及其形成方法
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申请号： US11395457申请日： 2006-03-31
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公开(公告)号： US07659194B2公开(公告)日： 2010-02-09
- 发明人: Rajiv Shah , Shaun Pendo
- 申请人： Rajiv Shah , Shaun Pendo
- 申请人地址： US CA Northridge
- 专利权人： Medtronic MiniMed, Inc.
- 当前专利权人： Medtronic MiniMed, Inc.
- 当前专利权人地址： US CA Northridge
- 代理机构： Foley & Lardner LLP
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763
摘要：
A multilayer circuit substrate for multi-chip modules or hybrid circuits includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by shadow mask techniques. Substrates formed in this manner enable significant increases in interconnect density and significant reduction of over-all substrate thickness.
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