Invention Grant
- Patent Title: Hood for immersion lithography
- Patent Title (中): 用于浸没光刻的罩
-
Application No.: US11427434Application Date: 2006-06-29
-
Publication No.: US07675604B2Publication Date: 2010-03-09
- Inventor: Li-Jui Chen , Tzung-Chi Fu , Ching-Yu Chang , Fu-Jye Liang , Lin-Hung Shiu , Chun-Kuang Chen , Tsai-Sheng Gau
- Applicant: Li-Jui Chen , Tzung-Chi Fu , Ching-Yu Chang , Fu-Jye Liang , Lin-Hung Shiu , Chun-Kuang Chen , Tsai-Sheng Gau
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G03B27/52
- IPC: G03B27/52 ; G03B27/42

Abstract:
A lithography apparatus includes an imaging lens module; a substrate table positioned underlying the imaging lens module and configured to hold a substrate; a fluid retaining module configured to hold a fluid in a space between the imaging lens module and a substrate on the substrate stage; and a heating element configured in the fluid retaining module and adjacent to the space. The heating element includes at least two of following: a sealant insoluble to the fluid for sealing the heating element in the fluid retaining module; a sealed opening configured in one of top portion and side portion of the fluid retaining module for sealing the heating element in the fluid retaining module; and/or a non-uniform temperature compensation device configured with the heating element.
Public/Granted literature
- US20070258060A1 HOOD FOR IMMERSION LITHOGRAPHY Public/Granted day:2007-11-08
Information query