发明授权
- 专利标题： Method of processing a circuit board
- 专利标题（中）： 处理电路板的方法
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申请号： US11549869申请日： 2006-10-16
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公开(公告)号： US07676920B2公开(公告)日： 2010-03-16
- 发明人: Sandor T. Farkas , Hector F. Martinez , Bhavesh Patel , Indrani Paul , Larry P. Robison, Jr. , Darrell J. Slupek , Aubrey Sparkman
- 申请人： Sandor T. Farkas , Hector F. Martinez , Bhavesh Patel , Indrani Paul , Larry P. Robison, Jr. , Darrell J. Slupek , Aubrey Sparkman
- 申请人地址： US TX Round Rock
- 专利权人： Dell Products L.P.
- 当前专利权人： Dell Products L.P.
- 当前专利权人地址： US TX Round Rock
- 代理机构： Pramudji Wendt & Tran, LLP
- 主分类号： H01K3/10
- IPC分类号： H01K3/10 ; G01R31/02
摘要：
A test coupon on a printed circuit board used for verifying that vias in the printed circuit board are back drilled to a proper predetermined depth. Use of the coupon involves correlating a via on the board to a via of a test coupon drilling the board via and the test coupon via to substantially the same depth, where the depth is predetermined based on the board via. Then measuring the impedance of the test coupon to reveal the actual depth of the back drilling of the coupon via. Knowing the actual back drill depth of the coupon via is used to verify the back drill depth of the board via.
公开/授权文献
- US20080087461A1 Combination Impedance/Back Drill Coupon 公开/授权日：2008-04-17