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公开(公告)号:US20080087461A1
公开(公告)日:2008-04-17
申请号:US11549869
申请日:2006-10-16
申请人: Sandor T. Farkas , Hector F. Martinez , Bhavesh Patel , Indrani Paul , Larry P. Robison , Darrell J. Slupek , Aubrey Sparkman
发明人: Sandor T. Farkas , Hector F. Martinez , Bhavesh Patel , Indrani Paul , Larry P. Robison , Darrell J. Slupek , Aubrey Sparkman
CPC分类号: H05K3/0047 , H05K1/0237 , H05K1/0268 , H05K3/429 , H05K2203/0207 , H05K2203/0242 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要: A test coupon on a printed circuit board used for verifying that vias in the printed circuit board are back drilled to a proper predetermined depth. Use of the coupon involves correlating a via on the board to a via of a test coupon drilling the board via and the test coupon via to substantially the same depth, where the depth is predetermined based on the board via. Then measuring the impedance of the test coupon to reveal the actual depth of the back drilling of the coupon via. Knowing the actual back drill depth of the coupon via is used to verify the back drill depth of the board via.
摘要翻译: 用于验证印刷电路板中的通孔的印刷电路板上的测试试样被回到适当的预定深度。 使用优惠券包括将电路板上的通孔与通过电路板通孔的测试券和测试券通过基本相同的深度相关联,其中深度基于板通孔预定。 然后测量试样的阻抗,以显示试样通孔背面钻孔的实际深度。 了解优惠券通道的实际后钻深度用于验证板通孔的后钻深度。
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公开(公告)号:US07676920B2
公开(公告)日:2010-03-16
申请号:US11549869
申请日:2006-10-16
申请人: Sandor T. Farkas , Hector F. Martinez , Bhavesh Patel , Indrani Paul , Larry P. Robison, Jr. , Darrell J. Slupek , Aubrey Sparkman
发明人: Sandor T. Farkas , Hector F. Martinez , Bhavesh Patel , Indrani Paul , Larry P. Robison, Jr. , Darrell J. Slupek , Aubrey Sparkman
CPC分类号: H05K3/0047 , H05K1/0237 , H05K1/0268 , H05K3/429 , H05K2203/0207 , H05K2203/0242 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要: A test coupon on a printed circuit board used for verifying that vias in the printed circuit board are back drilled to a proper predetermined depth. Use of the coupon involves correlating a via on the board to a via of a test coupon drilling the board via and the test coupon via to substantially the same depth, where the depth is predetermined based on the board via. Then measuring the impedance of the test coupon to reveal the actual depth of the back drilling of the coupon via. Knowing the actual back drill depth of the coupon via is used to verify the back drill depth of the board via.
摘要翻译: 用于验证印刷电路板中的通孔的印刷电路板上的测试试样被回到适当的预定深度。 使用优惠券包括将电路板上的通孔与通过电路板通孔的测试券和测试券通过基本相同的深度相关联,其中深度基于板通孔预定。 然后测量试样的阻抗,以显示试样通孔背面钻孔的实际深度。 了解优惠券通道的实际后钻深度用于验证板通孔的后钻深度。
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